List of Semiconductor Manufacturing Equipment products
- classification:Semiconductor Manufacturing Equipment
226~270 item / All 5118 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
A device for arranging broken wafers in order of lot number.
- Semiconductor inspection/test equipment
"I want to increase uniformity more," "It's inevitable that liquid unevenness occurs with ultra-thin materials," such concerns can be resolved all at once!
- Other semiconductor manufacturing equipment
- Used goods purchase
The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!
- Wafer processing/polishing equipment
Supports manufacturing with precision of +0, -0.005mm (5μm) in outer diameter grinding processing. Centerless finishing of free-cutting phosphor bronze round bars.
- probe
- Semiconductor inspection/test equipment
- Non-ferrous metals
Resist stripping and lift-off equipment supporting the manufacturing of high-precision MEMS devices.
- High pressure cleaner
- Resist Device
High-performance resist stripping equipment that supports the microfabrication process.
- High pressure cleaner
- Resist Device
With our core technology, we respond to our customers' themes! Haimeka will walk alongside our customers!
- Contract manufacturing
- Other semiconductor manufacturing equipment
- Circuit board design and manufacturing
Contributes to the efficiency and quality improvement of semiconductor manufacturing processes. Since there are no specialized parts, maintenance is easy, allowing for quick recovery. It achieves low ...
- Semiconductor inspection/test equipment
We provide consistently! Electronic components, electronic modules, electronic equipment inspection devices.
- Semiconductor inspection/test equipment
We will analyze trace amounts of organic contaminants adhered to the material using TD-GC/MS.
- Contract measurement
- Semiconductor inspection/test equipment
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
- Other semiconductor manufacturing equipment
Notice of Exhibited Products and Events for Nepcon Japan 2024
We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.
We propose a custom-made dispenser that fulfills your ideals.
- Other semiconductor manufacturing equipment
Achieved over 50% higher throughput compared to conventional serial testers by adopting Per-Pin architecture!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
Supports PAM4/NRZ signals and covers the 1.6TBASE/CEI-224G standard!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
Ideal for transporting thin wafers, glass substrates, metal foils, films, and more! Eliminates localized stress on the objects caused by conventional vacuum suction methods!
- Other semiconductor manufacturing equipment
High-Spec Dedicated Load Grinding Device
- Wafer processing/polishing equipment
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
- Wafer processing/polishing equipment
- Other abrasives
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
- Wafer processing/polishing equipment
- Other abrasives
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!
- Analytical Equipment and Devices
- Moisture Measuring Device
- Semiconductor inspection/test equipment
The standard seismic isolation device "ISO-Base" can be retrofitted, reconfigured, and reused! Earthquake protection for IT equipment has become surprisingly easy.
- Other semiconductor manufacturing equipment
We will be exhibiting at the 32nd Industrial Technology Exhibition "Technical Show Yokohama" from February 2 (Wednesday) to February 4 (Friday), 2011.
We will be exhibiting at the Technical Show Yokohama held at Pacifico Yokohama. The exhibits will include: - Key management made easy! "IC Key Terminal" - Access control system - Production management system, production scheduler and more. We invite you to take this opportunity to see our products. If you would like an invitation ticket, please write "Request for invitation ticket" to info@biss.co.jp and provide your contact information. You can also do this through the Ipros page. You can find more details below: http://www.ipros.jp/company/254201/products_detail000000040.html
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
Liquid hazardous materials can also be safely transported with all-fiber solutions.
- Wafer
- Resist Device
- Photomask
It is an environmentally friendly cleaning device that does not use chemical solutions.
- Other semiconductor manufacturing equipment
It can achieve high sensitivity detection for all AMC categories.
- Semiconductor inspection/test equipment
The installation direction can be freely set! Achieving maintenance-free operation with a long lifespan of 30 million rotations!
- Slip Ring
- Sputtering Equipment
A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.
- High pressure cleaner
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.
- Other semiconductor manufacturing equipment
Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.
- Other semiconductor manufacturing equipment
- others
- Other Connectors
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
- Tester
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
- Tester
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.
- Semiconductor inspection/test equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment