List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
226～270 item / All 5007 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
"We want to confirm the effectiveness of the coating in advance." To meet such needs, Yoshida SKT also offers measurements of the coated surface.
- Resist Device
[Presentation of Materials] We will introduce the differences in features between Teflon fluoropolymer "PTFE" and "PFA" resins and coatings.
- Other semiconductor manufacturing equipment
Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!
- Hand polishing and filing
- Grindstone
- Wafer processing/polishing equipment
The standard seismic isolation device "ISO-Base" can be retrofitted, reconfigured, and reused! Earthquake protection for IT equipment has become surprisingly easy.
- Other semiconductor manufacturing equipment
We will be exhibiting at the 32nd Industrial Technology Exhibition "Technical Show Yokohama" from February 2 (Wednesday) to February 4 (Friday), 2011.
We will be exhibiting at the Technical Show Yokohama held at Pacifico Yokohama. The exhibits will include: - "IC Key Terminal" for key management - Access control system - Production management system, production scheduler and more. Please take this opportunity to see our products. If you would like an invitation ticket, please write "Request for invitation ticket" to info@biss.co.jp and provide your contact information. You can also do this through the Ipros page. You can find more details below: http://www.ipros.jp/company/254201/products_detail000000040.html
100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
![[Compact & Lightweight] UV (Ultravi...](https://image.mono.ipros.com/public/product/image/2b2/2000455383/IPROS90958152167746040604.png?w=280&h=280){kind=small}
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
![[Compact & Lightweight] UV-LED Irra...](https://image.mono.ipros.com/public/product/image/41b/2000460215/IPROS62495294798517871344.png?w=280&h=280){kind=small}
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
By using heat reflection and laser technology, LIT narrows down the heat generation points beneath the metal layer, which were difficult to detect, to as small as 2μm, breaking through the limits of h...
- Semiconductor inspection/test equipment
- Defect Inspection Equipment
TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)
- Other semiconductor manufacturing equipment
Invitation to Exhibit at the Microwave Exhibition 2025
Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe
We have various types available, including high-load types and those that can be fixed to walls.
- Workstation
- Semiconductor inspection/test equipment
- Desktop PC
You can individually or simultaneously switch the negative pressure of the airway ON/OFF.
- Vacuum Equipment
- Sealing
- Other semiconductor manufacturing equipment
We provide repair and improvement services with extensive experience in peripheral equipment for semiconductor manufacturing devices.
- Other semiconductor manufacturing equipment
Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!
- drill
- Wafer processing/polishing equipment
Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.
- drill
- Wafer processing/polishing equipment
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
- drill
- Wafer processing/polishing equipment
Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!
- Other surface treatment equipment
- Wafer processing/polishing equipment
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
- Wafer processing/polishing equipment
- Tap
Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Good hole processing is possible! You can regrind the brooch and reduce purchase costs.
- Wafer processing/polishing equipment
Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
The grinding stone is CBN #150! A precision end mill grinder capable of sharpening the tip and side edges.
- drill
- Wafer processing/polishing equipment
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
A super high-resolution camera capable of wide-angle and ultra-high-definition imaging, suitable for various MV applications.
- Monochrome camera
- Color camera
- Semiconductor inspection/test equipment
A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!
- Analytical Equipment and Devices
- Moisture Measuring Device
- Semiconductor inspection/test equipment
Minimize the footprint within the device! But with excellent high pressure and flow capacity! Fluororesin valve.
- valve
- Other semiconductor manufacturing equipment
Fluororesin diaphragm valve ideal for abrasive fluids such as slurries.
- CMP Equipment
[Online Exhibition 3/8-3/10] Invitation to Exhibit at the Future of Japanese Manufacturing Exhibition
From March 8 to 10, 2021, we will be exhibiting at the "Future of Japanese Manufacturing" exhibition. Once called a "manufacturing powerhouse," the Japanese manufacturing industry is now facing a crisis due to delays in digital transformation (DX) and other factors, bringing together technologies that will have a significant impact. Mr. Akira Ikegami and Mr. Wang, the chairman of HUAWEI, will also be speakers at the event. This is an opportunity to think together about the "future" of Japanese manufacturing! We look forward to your visit.
All-fluoropolymer durable pressure gauge!!
- Pressure
- CMP Equipment
- Other semiconductor manufacturing equipment
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
☆★☆ Spatter and Vapor Deposition Source Combined Film Formation Device 【nanoPVD-ST15A】 ☆★☆
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device. Metal deposition, organic deposition, and sputter cathode are installed in a compact frame. A resistance heating evaporation source (for metal deposition), an organic evaporation source (for organic materials), and magnetron sputtering (for metals and insulating materials) are installed in the chamber, allowing for various thin film experimental setups within a single chamber. ◉ Three combinations available: 1. Sputter Cathode + Resistance Heating Evaporation Source x2 2. Sputter Cathode + Organic Evaporation Source x2 3. Sputter Cathode + Resistance Heating Source x1 + Organic Evaporation Source x1 (*DC sputtering only) 【Specifications】 ◉ Compatible substrates: up to Φ4 inches ◉ Sputtering: 2" cathode x up to 3 sources ◉ Vacuum deposition: Resistance heating evaporation (up to 2), organic evaporation (up to 4) ◉ 7" touch panel operation with PLC automatic process control ◉ APC automatic pressure control ◉ 1 line of Ar gas (standard) + expandable with N2, O2 ◉ Connects to a Windows PC via USB for recipe creation and storage. Data logging on PC ◉ Various other options available ◉ Easy operation with a 7" touch panel and PLC automatic process control
We will extend the life of your equipment with bolt-on and coupler-on solutions.
- Sputtering Equipment
- Solenoid Actuators
- Transport and handling robots
TKC Corporation Nagaoka Service Center Opening: We will achieve one-stop device regeneration and prolongation.
In recent years, we have received numerous requests for extending the lifespan of operational equipment. With the advancement of high functionality in both equipment and components, the specialization of repair services has progressed. Along with this specialization, it has become increasingly difficult to provide comprehensive "repairs" through integrated diagnostics and verification. With the establishment of this service center, we will offer one-stop regeneration and lifespan extension through "comprehensive diagnostics of equipment" by our skilled engineers and the "integration of specialized techniques" from partner engineers located nationwide.
Fluororesin coating F-200SI, effective as a corrosion prevention measure against hydrogen sulfide generated in hot spring areas, water treatment plants, livestock farming, and recycled paper factories...
- Other semiconductor manufacturing equipment
This is a formed bellows for vacuum piping, equipped with JIS standard vacuum flanges.
- Other semiconductor manufacturing equipment
- Vacuum Equipment
It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
![[Polishing Technology] Ultra-Precis...](https://image.mono.ipros.com/public/product/image/54f/2000603990/IPROS83849052596060099439.png?w=280&h=280){kind=small}
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment