List of Semiconductors and ICs products
- classification：Semiconductors and ICs
991～1035 item / All 4375 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Forced air cooling heat sink combining a hollow heat sink with dimensions of 160mm width, 83mm height, and 150mm length, and a DC24V axial fan.
- Other semiconductors
GC/MS: Gas Chromatography-Mass Spectrometry
- Contract Analysis
- Memory
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
Chemical calculation software / Finite element method simulator for predicting the performance of spin qubits before manufacturing.
- Other semiconductors
For applications such as generators and elevators! The synergy with solder bonding on both sides of the chip improves long-term reliability.
- Other semiconductors
There is a track record of growing nitride semiconductor crystals on various semiconductor substrates. Customization is also possible according to your requests.
- CVD Equipment
- LED Module
- Wafer
This is a three-dimensional processed product realized with our 5-axis machining center.
- Other semiconductors
We also process ultra-thin silicone rings with high precision.
- Other semiconductors
These are polyhedral processing samples of hard-to-cut materials such as alumina, silicon, and glass.
- Other semiconductors
A one-stop shop from connectors to harness processing. We take on challenges for prototypes and mass production with short delivery times and competitive prices. Waterproof and airtight testing is ava...
- Memory
- Memory
Mounting pads for transistors from Fischer Elektronik for protection and installation at uniform intervals.
- Other semiconductors
H50 x W50 x L75 mm aluminum heat sink + DC12V axial fan heat dissipation device compatible with transistor clips
- Other semiconductors
Forced air cooling set with W100.5mm x H50mm x L100mm aluminum heat sink + two DC12V axial fans.
- Other semiconductors
Ideal for preventing degradation or destruction of ICs and components from overcurrent during load short circuits and overvoltage due to abnormalities in surrounding devices!
- ASIC
We will also search for parts that have been rejected by other companies.
- Microcomputer
- Memory
- Embedded Board Computers
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
- Printed Circuit Board
- Microcomputer
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
We have overseas sales achievements! Our strengths are a wide variety of products and the trust of Made in Japan!
- fiber
- Other semiconductors
Standard type aluminum extruded small heat sink with a width of 12.6mm and a height of 6.5mm.
- Other semiconductors
It is possible to easily respond to security requirements for existing products!
- Dedicated IC
- Other semiconductors
A heat sink with two 24VDC fans set on an aluminum heat sink measuring W120mm x H60mm x L150mm.
- Other semiconductors
A heat dissipation device that combines an aluminum heat sink compatible with transistor clips and a DC 12V axial fan.
- Other semiconductors
Aluminum filler with high thermal conductivity and heat dissipation properties.
- Wafer
From semiconductor substrates to powder applications. A lineup of grades tailored to diverse needs!
- Other semiconductors
We will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held in Shenzhen, China from June 4 (Wednesday) to June 6 (Friday), 2025!
Our group company in China, Hunan Ningxiang Jiweixin Metal Powder Co., Ltd., will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held from June 4 (Wednesday) to June 6 (Friday), 2025. This exhibition will be a comprehensive showcase of heat conduction and heat dissipation materials and equipment. At our booth, we plan to introduce a wide variety of aluminum powders, including high-purity aluminum powder, aluminum alloy powder, and aluminum nitride. We sincerely look forward to your visit.
It is predicted to grow at an average annual growth rate of 5.7% from 2025 to 2031.
- others
- Other semiconductors
Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
- Wafer
- Dedicated IC
- Other semiconductors
Realizing non-contact thickness measurement of various materials that transmit white light.
- Other measurement, recording and measuring instruments
- Sensors
- Wafer
Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes
45mm diameter x 30mm height round pin fin heat sink (Al99.5)
- Other semiconductors