Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
196～210 item / All 541 items
Response to urgent measures for lubrication troubles, as well as proactive use for break-in operations and preventive maintenance.
A high-performance extreme pressure additive with over 25 years of proven results since its introduction to the market. It supports a wide range of applications, from emergency measures for lubrication troubles to proactive use for break-in and preventive maintenance.
Evolving stacked via technology to improve wiring flexibility! Newly developed additives for copper plating specialized in film thickness uniformity for fine circuit formation for high-speed transmission.
The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.
A new copper sulfate plating additive has been developed specifically for horizontal conveyor roll-to-roll plating equipment, enabling via filling plating on flexible circuit boards.
In conventional horizontal transport Roll to Roll plating equipment, there was a problem where copper oxidized during the transfer of substrates, leading to a decrease in via filling performance. Our company has successfully developed an additive that incorporates components to control the weak current flowing during inter-cell movement, achieving both good filling properties and throwing power (patent obtained). The high-filling copper sulfate plating additive, Topruchina SVP, enables further densification and multilayering of flexible circuits, making it ideal for improving the efficiency of flexible circuit board manufacturing.
TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.
Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.
Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.
Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.
Topluchina FRV, a copper sulfate plating additive that achieves both high filling capability and in-plane uniformity, is optimal for the implementation of semiconductor package substrates.
In the implementation of semiconductor package substrates, attention is being drawn to Fan-Out Wafer Level Packaging (FOWLP) technology. In the case of FOWLP, wiring (redistribution layer) is formed in the internal area of the semiconductor package substrate. In traditional bump connections, it was necessary to electrically connect the semiconductor chip and the terminals of the package substrate. Additionally, in wire bonding using fine wires of gold or aluminum, there was a problem where increasing the number of terminals made it difficult to achieve reliable electrical connections. Therefore, the practical application of fan-out packaging technology, which allows multiple chips to be mounted side by side (multi-chip) without limitations based on chip size, is rapidly advancing. Our company has newly developed a copper sulfate plating solution that enables high filling and in-plane uniformity for the formation of redistribution layers on semiconductor wafers.
Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"
This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.
FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.
In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.
Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.
With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.
Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!
■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.
An additive that promotes the microbial degradation of polyolefin resins, which are difficult to decompose by microorganisms!
"P-Life" is a highly safe microbial degradation plastic additive developed based on years of testing and verification in various countries around the world. The basic addition amount is 1.5% or more (masterbatch), enabling the production of microbial degradation resin products at a low cost. The components are registered in the national positive list based on the revised Food Sanitation Act (updated April 2022). It also complies with the Ministry of Health, Labour and Welfare Notification No. 370 of the Food Sanitation Act. 【Features】 ■ An additive based on fatty acids refined from plant oils (biomass) ■ Microbial degradation resins include polyethylene (PE) and polypropylene (PP) ■ The physical properties of the added resin products are equivalent to those of standard resin products ■ The microbial degradability of the added plastic products has been verified according to JIS K6955 (ISO 17556) *For more details, please refer to the PDF materials or feel free to contact us.
Highly safe microbial degradation plastic additives! Includes results of microbial degradation tests in soil environments.
This document provides an explanation of P-Life biodegradable plastic additives and their market development. It includes information on P-Life biodegradable plastic technology, product lineup, functions, and microbial decomposition mechanisms. Since 2003, sales of P-Life have started primarily in the Asia-Pacific region, and currently, the sales area has expanded to all regions of the world. 【Contents】 ■ Company Overview ■ P-Life Biodegradable Plastic Technology ■ P-Life Product Lineup ■ Functions and Microbial Decomposition Mechanisms of P-Life (Additives) ■ Results of Microbial Decomposition Tests in Soil Environment Part 1 *For more details, please refer to the PDF document or feel free to contact us.
Loved for 60 years and still the same ease of use.
The powerful adhesive "Kanestic" is a school adhesive widely used in educational materials. It is characterized by excellent initial adhesion, quick-drying properties, and strong bonding strength. Properties: Excellent initial adhesion, quick-drying, and strong bonding strength. Uses: Sculpting, furniture and toy repair, model making, doll making, etc. Adhesive materials: Paper, wood, fabric, leather, foam, glass, acrylic sheets, ceramics, metal, various synthetic resins, fiberglass, and more. *For more details, please contact us or download the PDF.
NUKOTE Comprehensive Catalog
Polyurea is a resin compound based on urea bonds generated by the chemical reaction between isocyanates and polyamines. It is a lining material that dramatically enhances the strength of objects for various applications, exhibiting extremely high capabilities in waterproofing, chemical resistance, abrasion resistance, heat resistance, and corrosion resistance. Its fast-drying properties, which cure in seconds to minutes, allow for use in all situations and expand the range of applications. Additionally, certain grades boast an elongation rate of over 400%, and the strength provided by its flexibility is even used for blast protection in military facilities. Being solvent-free, it is also environmentally friendly, making it an overwhelmingly "tough yet easy" next-generation lining material—this is "Polyurea." 〇 Excellent flexibility 〇 Fast curing and short construction time 〇 Superior chemical resistance and corrosion resistance 〇 Solvent-free 【Purpose and Applications】 ■ Chemical corrosion resistance - chemical tanks, quarantine embankments, drainage tanks, various chemical plant equipment ■ Blast and impact resistance - chemical tanks, quarantine embankments, drainage tanks, various chemical plant equipment ■ Waterproofing - underground pits, concrete waterways, waterproofing for building rooftops ■ Weather resistance - outdoor facilities, equipment, factory roofs, outdoor flooring ■ Abrasion resistance - factory flooring, dams, livestock facilities, mining equipment *For more details, please download the PDF or contact us.
"POLYUREA GLOBAL" Comprehensive Catalog
Polyurea is a resin compound based on urea bonds produced by the chemical reaction between isocyanates and polyamines. It exhibits extremely high capabilities in waterproofing, chemical resistance, abrasion resistance, heat resistance, and corrosion resistance, dramatically enhancing the strength of objects for various applications. Its fast-drying properties allow it to cure in seconds to minutes, making it usable in all situations and expanding the scope of construction. Additionally, certain grades boast an elongation rate of over 400%, and the strength provided by its flexibility is even used for blast protection in military facilities. Being free of solvents and other harmful substances, it is also environmentally friendly, making it an overwhelmingly "tough yet easy" next-generation lining material—this is "Polyurea." 【Features】 ■ Chemical corrosion resistance ■ Blast and impact resistance ■ Waterproofing ■ Weather resistance ■ Abrasion resistance *For more details, please download the PDF or contact us.
