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CPU Module×Suntex Co., Ltd. - List of Manufacturers, Suppliers, Companies and Products

CPU Module Product List

16~30 item / All 56 items

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SECO CPU Module Trizeps VIII Mini

Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family

Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO Industrial CPU Module Trizeps VII

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX M6 family

Features ■ Equipped with NXP i.MX6 application processor (from Solo to QuadCore) ■ Supports 1x 100/1000 Megabit Ethernet, WiFi/Bluetooth, USB 2.0, PCIe, HDMI ■ Vivante GC3500 2D accelerator + Vivante GC2000 3D accelerator ■ Onboard LPDDR3-1066 memory up to 2GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with OS Win10 IoT/Ubuntu/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO Industrial CPU Module Trizeps VII SX

Trizeps SODIMM-200 CPU module, NXP i.MX 6SoloX, ARM Cortex-A9

Features ■ Equipped with NXP i.MX 6SoloX, single-core Cortex-A9@1GHz + Cortex-M4 core@227MHz processor ■ Supports 2x Fast Ethernet, WiFi/Bluetooth, USB 2.0, PCIe ■ Vivante GC400T, 2D and 3D hardware accelerator ■ Onboard LPDDR3-533 with up to 2GB memory ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with Win Embedded Compact 2013/7/Linux

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO SMARC CPU Module LEVY (SM-D18)

NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm

Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO Qseven CPU Module ATLAS

Pentium J/N6000/Atom x6000E series, equipped with onboard LPDDR4-3200 with a maximum of 16GB.

Features ■ Equipped with Intel Atom x6000E series and Intel Pentium and Celeron N and J series processors ■ 1x GbE with precision time protocol IEEE 1588, 6x USB 2.0, 2x SuperSpeed USB 10Gbps, supports up to 4x PCI-e ■ Integrated Intel Gen 11 UHD graphics controller with up to 32 EU ■ Onboard LPDDR4-3200 memory with a maximum of 16GB ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Win10 IoT/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO Qseven CPU Module ASTERION

Celeron J1900/N2x00/Atom E3800 series, onboard DDR3L-1333 with a maximum of 8GB memory.

Features ■ Supports Intel Atom E3800 and Celeron family ("Bay Trail") ■ 6x USB 2.0; 1x USB 3.0; 3x PCI-e x1 ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40–85℃) ■ Dimensions: 70x70 mm (2.76” x 2.76”) ■ OS Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM-HPC CPU Module ORION

12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm

Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android

  • Embedded Board Computers
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  • Image Processing Board

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SECO COM-HPC CPU Module LAGOON

11th Xeon W-11000E/Core i series, equipped with 2xDDR4-3200 ECC, maximum 64GB memory.

Features ■ Supports 11th generation Intel Xeon, Core, and Celeron processors ■ 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU, supports up to 4 independent displays ■ Equipped with 2x DDR4-3200 ECC memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO ETX CPU Module ETX-A61

Celeron J1900/N2x00/Atom E3800 series, onboard DDR3L-1333 with a maximum of 8GB memory.

Features ■ Supports Intel Atom E3800 and Celeron families ■ Compatible with PCI Bus 2.3; ISA Bus; LPT; PS/2 ■ Integrated Intel HD graphics 4000 Series controller with dual independent display support ■ Onboard DDR3L-1333 memory, up to 8GB ■ Operating temperature: 0 to 60°C ■ Dimensions: 114x95 mm (4.49” x 3.74”) ■ OS: Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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12th COM Express CPU Module Type 6

12th Gen Core i7-12800HE/i5-12600HE/i3-12300HE, 2xDDR5 up to 64GB

【ADLINK Express-ADP Features】 ■ 12th Generation Intel Core Processor ■ Up to 14 cores (6 P-cores, 8 E-cores), 20 threads ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel Iris Xe Graphics, 4x 4K display ■ Capable of displaying 4 screens simultaneously at 4K60 HDR ■ 4K display via DDI, eDP 1.4b, USB4, and TBT4 ■ Up to 64GB DDR5 (up to 4800 MT/s) ■ 16x PCIe Gen4, 5x PCIe Gen3 lanes ■ 2.5GbE, TSN compatible ■ 4x USB 3.x/2.0 and 4x USB 2.0 ■ 2x SATA ■ NVMe SSD support

  • Embedded Board Computers

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Portwell CPU Module PCOM-B638VG

6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)

  • Embedded Board Computers
  • Evaluation Board

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Portwell CPU Module PCOM-B634VG

6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)

  • Embedded Board Computers
  • Evaluation Board

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COM Express Type6 Express-KL/KLE

7th generation Core i7/i5/i3/Xeon CPU equipped, type 6 CPU module

Features ■ Equipped with 7th generation Intel Core i7/i5/i3/Xeon CPU. ■ Intel QM175 / HM175 / CM238 chipset (old codename: Kaby Lake) included. ■ Memory 2133/2400MHz DDR4 SO-DIMM x2 (up to 32GB) ■ Supports 3x DDI channels, 1x LVDS (eDP), and 3 independent display outputs. ■ 8x PCIe [x1] (Gen3), 1x PCIe [x16] (Gen3) ■ GbE, 4x SATA3 (6Gb/s), 4x USB3.0, 4x USB2.0 ■ Supports Smart Embedded Management Agent (SEMA) functionality. ■ Extended operating temperature: -40℃ to +85℃ (optional)

  • Embedded Board Computers
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  • Image Processing Board

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ADLINK Qseven CPU Module Q7-AL

Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU

Features ■ Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU. ■ Onboard memory 2400MHz LPDDR4 (up to 8GB) ■ Intel 9th generation low power graphics, 4K resolution/H.265 codec ■ Dual channel LVDS (18/28-bit) or 2x eDP, HDMI/DP ■ 2x MIPI CSI camera (2/4 lanes) ■ GbE, USB3.0, 2 SATA3 (6.0GBit/s) ■ Featuring Sema for easy integration of hardware monitoring and controlling ■ Compliant with Qseven 2.1 ■ Extended operating temperature: -40℃ to +85℃ (optional)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module JULIET

type7 Xeon D-1700 (Ice Lake-D), 4xDDR4-2400/2666/2933 ECC maximum 128GB

Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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