31～45 item / All 56 items
COMe-B09-BT6, Type6 7th/6th Gen Core i7/i5/i3/Xeon
Features ■ COM Express Basic Size Type 6 ■ Intel 6th and 7th Generation Core/Xeon CPU ■ 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel HD Graphics 530/P530/630/P630 ■ 2x DDR4 So-DIMM slots
COMe-C24-CT6, Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900
Features ■ COM Express 3.0 Basic Size Type 6 ■ Intel Atom X, Intel Celeron J/N, Intel Pentium N series processors ■ 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Intel HD Graphics 500 series controller with up to 18 execution units ■ 2x DDR3L SO-DIMM slots (supports DDR3L-1866 non-ECC memory)
COMe-A41-CT6, Type 6 Celeron J/N/Atom E3800 series, 2xDDR3L-1333 maximum 8G
Features ■ Compatible with COM Express Compact Type 6 ■ Intel Atom E3800 and Celeron family (formerly Bay Trail) ■ 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Intel Integrated HD Graphics 4000 series controller ■ 2x DDR3L SO-DIMM slots (up to 8G)
COMe-C42-BT7, Type 7 AMD EPYC Embedded 3000, 4xDDR4-2666 ECC maximum 128GB
Features ■ COM Express R3.0 Type 7 Basic equipped with AMD EPYC Embedded 3000 ■ 4x USB 3.1; 24x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Supports up to 128GB of ECC DDR4-2666 memory with 4 DDR4 SO-DIMM slots
Type6 Compact AMD Ryzen Embedded V2000, 2xDDR4-3200 ECC up to 64GB
Features ■ Embedded Ryzen V Series V2000FP6 platform equipped with "Zen2" CPU and Radeon GPU core ■ 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3 ■ Integrated AMD Radeon GPU with up to 7 computing units ■ Two DDR4 SO-DIMM slots supporting up to 64GB of DDR4-3200 ECC and non-ECC memory ■ Adopts COM Express Compact Type 6 module
COMe-A98-CT6, Type 6 AMD Embedded Third Generation R/G Series, 2xDDR4-2133 ECC Maximum 64GB
Features ■ AMD built-in 3rd generation R series SOC or G series SOC-I ■ 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ AMD Radeon 3rd -Generation Graphics Core Next (GCN) ■ Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules
NXP i.MX 8X family, ARM Cortex-A72, equipped with up to 8GB of onboard LPDDR4-3200.
Features ■ Equipped with NXP i.MX 8 application processor ■ 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; supports boot select signal ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-3200 memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android
NXP i.MX 8M family, equipped with ARM Cortex-A53 and onboard LPDDR4-2400.
Features ■ Equipped with NXP i.MX 8M application processor ■ Supports 1x USB 3.0; 4x USB 2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-2400 memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android
μQ7-962, μQseven NXP i.MX 6 family, ARM Cortex-A9, equipped with onboard DDR3L.
Features ■ Equipped with single-core, dual-core, and quad-core (ARM Cortex-A9 core) ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard DDR3L with a maximum of 2GB memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto
μQ7-A75-J, μQseven NXP i.MX 6 Family, ARM Cortex-A9, equipped with onboard DDR3L
Features ■ Equipped with single and dual-core Lite (ARM Cortex A9 core) ■ Supports Fast Ethernet; GPI/O ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard with up to 1GB DDR3L memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus
Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M family
Features ■ Equipped with NXPi.MX8M application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, 2x USB 3.0 ■ Integrated GPU that supports multi-display ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm
Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android
NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm
Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android
Qualcomm Snapdragon 410E ARM Cortex-A53, size 48x32mm
Features ■ Equipped with Qualcomm Snapdragon 410E low-power processor ■ Onboard WLAN 802.11 b/g/n 2.4 GHz, Bluetooth 4.1, USB 2.0, supports LVDS, MIPI Display, and Camera ■ Supports OpenGL ES 3.0, OpenCL/DirectX 12 graphic acceleration for Windows 10 IoT Core ■ Onboard LPDDR4-2400 memory up to 4GB ■ Operating temperature -25 to 85℃ ■ Size: 48 x 32 x 4.2mm (without antenna) ■ Compatible with OS Win10 IoT/Linux/Android
