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CPU Module×SECO S.p.A - List of Manufacturers, Suppliers, Companies and Products

CPU Module Product List

31～45 item / All 67 items

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CPU module "METIS"

CPU module "METIS"

Operating temperature 0℃ to +60℃! Low-end AMD Ryzen on COM Express Type 6 Compact.

"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MIRANDA"

CPU module "MIRANDA"

Robust solutions for industrial environments! Introducing products that can be used in industrial temperature ranges.

The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "THEBE"

CPU module "THEBE"

Introducing a scalable product with excellent performance and enhanced connectivity!

"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "FINLAY"

CPU module "FINLAY"

Deep learning inference and UHD media processing! Applicable in fields such as automation and HMI.

The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "HALLEY"

CPU module "HALLEY"

SMARC Rel 2.1.1 for FuSa applications! Graphics support simultaneous three video outputs.

"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JAGER"

CPU module "JAGER"

High performance, low power consumption, and rich features! SMARC Rel. 2.1.1 module processor.

"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEVY"

CPU module "LEVY"

Low power design for embedded applications of machine learning at a higher level!

"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "WILK"

CPU module "WILK"

Equipped with MediaTek Genio 700 application processor! For information kiosks and more.

"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.

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Qseven Intel x6000E CPU module

Qseven Intel x6000E CPU module

Qseven Rev. 2.1 compliant, CPU module equipped with Intel Elkhart Lake.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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μQseven NXP i.MX6 CPU module

μQseven NXP i.MX6 CPU module

μQseven compliant, NXP i.MX6 equipped CPU module

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to achieve carrier board design compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick time to market

  • Embedded Board Computers

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Qseven NXP i.MX 8【MAIA】

Qseven NXP i.MX 8【MAIA】

Qseven Rev. 2.1 compliant CPU module with NXP i.MX 8.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick time to market

  • Embedded Board Computers

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μQseven NXP i.MX6 CPU module

μQseven NXP i.MX6 CPU module

μQseven compliant, NXP i.MX6 equipped CPU module

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM-HPC Intel 11th Generation CPU Module

COM-HPC Intel 11th Generation CPU Module

COM-HPC compliant CPU module with Intel Tiger Lake H (client)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express Intel 8th Generation CPU Module

COM Express Intel 8th Generation CPU Module

COM-EXPRESS TYPE6 compliant, Intel Whisky Lake equipped CPU module (compact)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express AMD EPYC CPU module

COM Express AMD EPYC CPU module

COM-EXPRESS TYPE7 compliant CPU module equipped with AMD EPYC Embedded 3000 (Basic)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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