Break device, sapphire, GaN, ceramic, GaAs, etc.
Introducing a break device compatible with 6-inch wafers! By exchanging the blade and table, it can accommodate wafers from 2 inches to 4 inches.
By using double-arm transport, the loading time for wafers is reduced. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Increased throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.*
- 企業：くまさんメディクス MPSD事業部 大津第1工場
- 価格：Other
