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Cleaning agents Product List and Ranking from 425 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Cleaning agents Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 中部 Aichi//Trading company/Wholesale
  2. アマダ（アマダグループ） Kanagawa//Industrial Machinery
  3. null/null
  4. 4 ゼストロンジャパン Kanagawa//Chemical
  5. 5 NCH Japan（日本エヌ・シー・エイチ株式会社） Tokyo//Other manufacturing
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Cleaning agents Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Technical Documentation: A Textbook on "Alternatives to Organic Solvents" That You Can't Ask About Now 中部
  2. 70% reduction in work without using thinner. Degreasing and cleaning online seminar. アマダ（アマダグループ）
  3. Fluorine-based cleaning agent "AMOLEA AS-300"
  4. 4 Water-soluble degreasing cleaner "ND-165" NCH Japan（日本エヌ・シー・エイチ株式会社）
  5. 5 An environmentally friendly cleaning agent 'Aero Rinse' as an alternative to IPA and others! 中部

Cleaning agents Product List

226～240 item / All 1613 items

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Cleaning Technology for Advanced Electronic Components: Mechanisms and Evaluation Methods for Residual Contamination [Document]

Cleaning Technology for Advanced Electronic Components: Mechanisms and Evaluation Methods for Residual Contamination [Document]

Contamination cleaning with bonding! The nature of "cleaning" that can ensure the performance of advanced electronic components.

This document explains the cleaning and post-cleaning analysis methods for advanced electronic components. Focusing on the contamination cleaning after joining, led by the flux cleaning process, it discusses the nature of "cleaning" that can ensure the performance of advanced electronic components, which are a collection of various technologies, as well as future prospects. Please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ The role of no-clean technology in enhancing functionality ■ Why cases requiring cleaning can occur ■ The challenges of cleaning advanced electronic components ■ Post-cleaning analysis *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for power electronics VIGON PE 305N

Cleaning agent for power electronics VIGON PE 305N

Simultaneous removal of flux and oxide film is possible! Suitable for use in complex power module manufacturing.

"VIGON PE 305N" is a neutral aqueous cleaning agent (MPC) developed for power electronics. It effectively removes flux residues from high-reliability, high-temperature solder pastes and excels in removing copper oxide films. It is suitable for cleaning power modules after soldering (such as die attach and heat sink soldering). 【Features】 ■ Excellent effectiveness in flux removal ■ Suitable for cleaning after sintering ■ Activates copper surfaces without staining ■ Well-suited for use in complex power module manufacturing ■ Does not affect passivation ■ Does not require explosion-proof equipment due to having no flash point *For more details, please refer to the PDF materials or feel free to contact us.

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Flux cleaner VIGON PE180 for power semiconductors and PCBs

Flux cleaner VIGON PE180 for power semiconductors and PCBs

No flash point! Neutral water-based cleaner is also excellent for removing oxide films from copper surfaces.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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Neutral flux cleaner for semiconductors - HYDRON SE 220

Neutral flux cleaner for semiconductors - HYDRON SE 220

Excellent material compatibility! It is possible to remove flux residues generated during die attachment and finish the subsequent processes to an optimal surface condition.

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaning agent VIGON A 201

Water-based flux cleaning agent VIGON A 201

High contamination tolerance! Long liquid life, low maintenance costs, reduced cost per cleaning part.

"VIGON A 201" is a flux cleaner that demonstrates excellent performance in spray cleaning in fine spaces such as under low stand-off components. This product, which is an MPC-based cleaner used at low concentrations, is particularly suitable for removing flux residues from no-clean solder that is eutectic and lead-free. It maintains a glossy solder joint surface without additives after cleaning. Additionally, it is suitable for removing tacky flux from flip chips and CMOS. 【Features】 ■ Cleans low stand-off components effectively ■ Particularly effective for lead-free no-clean solder ■ Maintains gloss on soldered areas of the substrate after cleaning ■ Long liquid life, low maintenance costs, and reduced cost per cleaned component ■ Easy rinsing, leaving no residues on the surface *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaner for printed circuit boards VIGON N 640

Water-based flux cleaner for printed circuit boards VIGON N 640

A product suitable for use in immersion cleaning! It can reduce the number of rinses.

"VIGON N 640" is a specially designed neutral cleaning agent for the removal of flux from printed circuit boards. It is suitable for use in batch spray cleaning machines. It offers excellent cleaning performance against advanced cream solder and fluxes that are generally difficult to remove. Additionally, it has excellent material compatibility with highly sensitizing metals such as copper and nickel. 【Features】 ■ Suitable for use in batch spray cleaning machines ■ Excellent operability, maintaining a constant concentration between the tank and chamber ■ Effective against difficult-to-remove cream solder ■ Can be easily rinsed with ion-exchanged water ■ High material compatibility due to its neutral nature *For more details, please refer to the PDF document or feel free to contact us.

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Water-soluble neutral flux cleaner VIGON N 680

Water-soluble neutral flux cleaner VIGON N 680

For spray cleaning processes! It has excellent material compatibility with highly sensitizing metals such as copper and aluminum.

"VIGON N 680" is a neutral cleaning agent specially designed for water-based spray cleaning (inline and batch). It effectively removes various flux residues from electronic circuit boards and can penetrate and clean even low stand-off components very well. Additionally, it has excellent material compatibility with metals that are highly sensitizing, such as copper. Please feel free to contact us if you have any inquiries. 【Features】 ■ Particularly excellent for cleaning under low stand-off components ■ High rinsability provides a wide range of applications ■ Superior material compatibility with highly sensitizing metals like copper and aluminum ■ Sufficient effectiveness even at low concentrations depending on the process ■ Can be sent to wastewater treatment without neutralization *For more details, please refer to the PDF document or feel free to contact us.

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Power semiconductor and printed circuit board water-based cleaning agent VIGON PE190A

Power semiconductor and printed circuit board water-based cleaning agent VIGON PE190A

No explosion-proof equipment is required as it does not have a flash point! Usable with various types of spray devices.

"VIGON PE 190A" is a water-based alkaline cleaner specifically designed for spray equipment. Based on MPC technology, it reliably removes flux residues from lead frames, discrete components, power modules, power LEDs, printed circuit boards, and especially from low stand components from below. It also demonstrates excellent effectiveness on severely oxidized or heavily soiled copper surfaces, ensuring superior material compatibility in subsequent processes such as wire bonding, adhesive bonding, and molding. 【Features】 ■ Reliably removes flux residues ■ Prepares copper surfaces in a clean state, activating them for bonding connections ■ Maintains an activated copper surface for an extended period without re-oxidation ■ Particularly excellent material compatibility with dies, without damaging passivation ■ Excellent rinsing properties, does not foam *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for power semiconductors and printed circuit boards / VIGON PE 194A

Cleaning agent for power semiconductors and printed circuit boards / VIGON PE 194A

Weakly alkaline flux cleaner, excellent rinsing properties, does not foam, suitable for spray and immersion equipment!

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent VIGON SC210 for SMT adhesives and metal masks

Water-based cleaning agent VIGON SC210 for SMT adhesives and metal masks

The VOC value is significantly below 20%! It can be used without explosion-proof equipment as there is no flash point.

The "VIGON SC 210" is a water-based cleaning agent specifically designed for cleaning SMT adhesives and metal masks. Based on MPC technology, it can reliably remove cream solder and SMT adhesives in a single process even at a low temperature of 18°C. Depending on the type of flux, it can also be used to clean misprinted circuit boards. Furthermore, it can remove adhesives from fixtures (especially dispenser nozzles) and is designed for spray cleaning and ultrasonic cleaning applications. 【Features】 - Stable and excellent cleaning performance in the temperature range of 18-40°C - Contains no surfactants, leaving no residue on circuit boards or inside equipment - Excellent material compatibility - Non-foaming, low odor, with no organic residue left in the rinsing process - Can also be used to remove adhesives from fixtures and dispenser nozzles *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaning agent for semiconductors HYDRON SE 230A

Water-based flux cleaning agent for semiconductors HYDRON SE 230A

Low surface tension is a characteristic! It provides good cleaning results even in narrow spaces.

"HYDRON SE 230A" is a one-phase type water-based cleaning agent for immersion processes. It reliably removes flux residues generated during die attach from various semiconductors such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Additionally, it excels in removing oxide films from copper substrates in post-processes such as wire bonding and molding. 【Features】 ■ Activates copper substrates without staining and maintains the activated surface for a certain period ■ Excellent material compatibility with highly sensitive materials ■ Superior flux removal after wafer bump formation ■ Easy process management due to its one-phase structure, demonstrating excellent performance in immersion processes ■ Good rinsing properties with ion-exchanged water, leaving no residues *For more details, please refer to the PDF document or feel free to contact us.

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What is a water-based cleaning agent? An explanation of the types of cleaning agents and the characteristics of water-based cleaning agents.

What is a water-based cleaning agent? An explanation of the types of cleaning agents and the characteristics of water-based cleaning agents.

An explanation focusing on the percentage of water content in aqueous cleaning agents!

Cleaning agents can be broadly classified into "solvent-based," "semi-aqueous," and "aqueous." At Zestron, we define "aqueous cleaning agents" as those where water is the primary component (with a water content of 50% or more). Even if they are referred to as aqueous cleaning agents domestically, there are specifications where organic components are the primary component, and even in cases referred to as semi-aqueous, many of the components may consist of solvent ingredients. While definitions and expressions vary, when discussing aqueous cleaning agents, we would like you to focus on the percentage of water content in the cleaning agent and understand its characteristics. *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

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Ion residue analysis: From invisible residues to defects?

Ion residue analysis: From invisible residues to defects?

How to check for the presence of invisible ion residues! Introducing cleaning know-how.

We are performing flux cleaning, and although no residues are visible after cleaning, reliability assessments show localized migration and corrosion of metal parts. The likely cause of this defect is the presence of invisible residues (ionic residues). If left unaddressed, various issues may arise, and in the worst case, it could lead to a fire. On this page, we will introduce how to check for the presence of invisible ionic residues. *For detailed information, please refer to the related links. For more information, please consult the PDF materials or feel free to contact us.*

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Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.

The joining technology of silver sintering (silver sinter) has been attracting attention in recent years. With the increase in electrical capacity and the utilization of new materials, there is a need for "new joining technologies" that can withstand higher temperatures, higher voltages, and larger currents. The silver sintering process can form a high-density bonding layer through pressing and sintering, resulting in high bonding strength. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Points to confirm for metal mask cleaning: How to choose cleaning agents and cleaning methods.

Points to confirm for metal mask cleaning: How to choose cleaning agents and cleaning methods.

It is possible to carry out cleaning with consideration for the environment! Introducing cleaning know-how.

This page provides an explanation of the key points to consider in metal mask cleaning. By selecting the appropriate cleaning agents and methods, it is possible to improve cleaning efficiency and work productivity, as well as reduce running costs, ensure worker safety, and implement environmentally considerate cleaning practices. Please check again. *For more details, you can view them through the related links. For further information, please refer to the PDF materials or feel free to contact us.

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