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[Examples of Diffusion Bonding Adaptation] Low Thermal Expansion High Thermal Conductivity Materials

Constructed with a core and core plate! Introducing a composite material that achieves both thermal conductivity and low thermal expansion rate.

We would like to introduce an example of diffusion bonding application for our "low thermal expansion high thermal conductivity material." It consists of a columnar body that facilitates heat transfer in the direction perpendicular to the surface, and a plate that suppresses the thermal expansion coefficient in the plane. The thermal conductivity is approximately 280 W/mK, and the in-plane thermal expansion coefficient is 5 to 10 ppm/K, making it a composite material that balances thermal conductivity and low thermal expansion. 【Features】 ■ Thermal conductivity: Approximately 280 W/mK ■ In-plane thermal expansion coefficient: 5 to 10 ppm/K ■ A composite material that balances thermal conductivity and low thermal expansion ■ Composed of a core and core plate *For more details, please refer to the PDF document or feel free to contact us.

• 企業：WELCON 本社
• 価格：Other

• Heat exchanger
• Other electronic parts
• air conditioning