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A new composite material that maximizes the super thermal conductivity of the core substrate at 1700 W/mk, allowing for brazing and soldering to heat sources and heat spreaders.
This is a metalized composite product that forms various thin and thick films of graphite using the dry and wet element technologies of the R&D venture TGC, making it the world's first of its kind. It is a bestseller among the popular Comproid series.
A heat dissipation and thermal diffusion product boasting an astonishing thermal conductivity of 1700 W/mk in the vertical (Z) direction, which was unimaginable for graphite-based heat dissipation materials until now!
CompoRoid Rsn is a composite product made from high thermal conductivity graphite and high heat-resistant epoxy resin. It is the most cost-effective resin composite product in the CompoRoid series, achieving both thinness and strength. It efficiently absorbs heat from heat sources such as ICs, LSIs, CPUs, GPUs, and chipsets sized 20 mm or smaller, providing powerful cooling capabilities.
The industry's first pseudo-isotropic super high thermal conductivity composite material with 1700 W/mk that can control heat transfer in all directions: X-Y-Z!
CompoLloid CC is a composite product made from carbon composites, allowing for size increase by bonding high thermal conductivity graphite, which serves as the core substrate. There are two types of products: large-area vertical (Z-direction) high thermal conductivity graphite plates and pseudo-isotropic thermal conductivity graphite plate products that can conduct heat in all directions (X-Y-Z). It is also possible to create double composite products such as gold plating or copper plate bonding. We will solve the problems of customers who have issues with anisotropy. Please let us know your size and shape requirements.
