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[Technical Introduction] Grinding Technology and Mirror Surface Technology

[Technical Introduction] Grinding Technology and Mirror Surface Technology

We respond to diverse needs with a variety of technologies! Introducing our high-quality manufacturing techniques!

Hakamura Engineering Co., Ltd. has established a system to manufacture high-quality products in a short period using cutting-edge processing machines and skilled technicians. In grinding technology, we produce everything from large diameters to ultra-fine pins through grinding, with the capability to manufacture lengths of approximately up to 400mm. Additionally, in mirror surface technology, we offer not only coatings tailored to your preferences but also suggestions based on your specific applications. [Technology] ■ Grinding Technology - Maximum diameter / Minimum diameter - Surface roughness of machined parts ■ Mirror Surface Technology *For more details, please refer to our catalog or feel free to contact us.

  • Contract manufacturing
  • Other processing machines
  • Grinding Machine

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Cutting and grinding technology

Cutting and grinding technology

Consistently manage all processes! Our quality assurance system is also robust, so you can trust us with your requests.

We would like to introduce the "cutting and grinding technology" of Aisei Industrial Co., Ltd. Cutting processing is performed based on customer drawings, starting from the material. Using a multi-axis CNC automatic lathe, we can simultaneously carry out milling processes such as cross holes, double-sided machining, and eccentric holes, while accurately processing perpendicularity, parallelism, and phase alignment. Grinding processing requires high precision at the micron level, but thanks to our long-developed technology, expertise, and management system, we achieve stable and high-precision grinding processing. 【Main materials for precision machine parts】 ■ S45C ■ SCM415 ■ SCM435 ■ SUS303 ■ SUS304 *For more details, please refer to the related links or feel free to contact us.

  • Other cutting tools
  • Grinding Machine
  • Wafer processing/polishing equipment

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