3D solder paste inspection device 'TR7007QI'
Accurate inspection is conducted even on printed circuit boards deformed by the SmartWarp correction system!
The "TR7007QI" is an inspection device built on 3D projection technology, providing maximum inspection accuracy to meet the stringent requirements of solder paste inspection. To achieve high inspection performance, it compensates for board warpage through TRI's innovative technology, including automatic optimization of the inspection route and the SmartWarp system. Additionally, it offers the choice of 4-directional and 2-directional projection inspection methods, making it a highly reliable universal SPI device that enables even more accurate inspections. 【Features】 ■ 100% shadow-free, selectable 2-directional/4-directional digital fringe projector ■ Optimization Stop&Go design aimed at achieving top-class accuracy ■ Accurate inspection even for deformed printed circuit boards thanks to the SmartWarp correction system ■ 100% detection of defects in solder paste, including low solder bridges *For more details, please refer to the PDF document or feel free to contact us.
- Company：ティアールアイ ジャパン 日本支社
- Price：Other
