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Inspection Equipment×ヒューブレイン - List of Manufacturers, Suppliers, Companies and Products

Inspection Equipment Product List

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Wafer appearance inspection equipment *Functions can be selected according to the inspection content!

Wafer appearance inspection equipment *Functions can be selected according to the inspection content!

A wafer appearance inspection device capable of high-precision inspection with the selection of functions tailored to the inspection content and a wide range of optional features.

We would like to introduce our "Wafer Appearance Inspection System." This system can inspect appearance defects that occur during the wafer process at high speed and with high precision. The inspection targets include LSI, LD, Di, LED, power semiconductors, compound semiconductors, and MEMS. Examples of defects inspected include chipping, cracking, scratches, pattern anomalies, foreign objects, coating defects, and misalignment. 【Features】 ■ Functions can be selected according to inspection requirements - Micro inspection, macro inspection - Color inspection, monochrome inspection - Area camera, line camera - Surface inspection, front and back inspection ■ High-precision inspection is possible with a wide range of optional features *For more details, please download the PDF or feel free to contact us.

  • Visual Inspection Equipment

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What is AI × rule-based hybrid image processing? *Technical materials are available.

What is AI × rule-based hybrid image processing? *Technical materials are available.

Introducing high-level automated transport technology that compensates for dimensions and area measurements, which are considered challenging for AI! Technical materials including examples of feature extraction and application cases will be provided!

This document contains technical information about "AI × Rule-Based Hybrid Image Processing" related to high-level automated transport technology. We will provide detailed examples of cases where AI struggles with certain processes, the collaboration between AI and rule-based systems, and how differences in shapes can be expressed as variations in feature quantities. Additionally, we will clearly explain examples such as the detection of bent pins and the recognition of individual piece positions, accompanied by images. 【Contents (Partial)】 ■ Example 1: Detection of thin defects through good product learning ■ Example 2: Recognition of individual piece positions ■ Example 3: Detection of bent pins ■ Example of feature quantity extraction: Mesh sheet ■ Application cases ■ What is AI × Rule-Based (Hu-Dra)? We will also be exhibiting at the "39th NEPCON JAPAN (East Hall 2 E15-32)" held at Tokyo Big Sight. [Exhibited Products] ■ Free-angle multi-link ■ 3D sensor ■ HU-CUBE AI inspection ■ One scan multiple triggers We sincerely look forward to your visit. *For more details, please download the PDF or feel free to contact us.

  • Image Processing Software

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