Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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31～45 item / All 55 items
NXP i.MX 8M Mini Family, ARM Cortex-A53, onboard LPDDR4 up to 8GB
Features ■ NXP i.MX 8M Mini Family ■ Wifi/BT, 1x GbE, up to 2x USB 2.0, HDMI, Mini PCIe ■ GC320 2D accelerator + GCNanoUltra 3D accelerator ■ Onboard LPDDR4 up to 8GB ■ OS Win10 IoT/Debian/Yocto/Android ■ Operating temperature -40 to 85℃ ■ 95.0 x 73.0 x 20.0 mm
BOXER AI@Edge Series for Embedded Systems, equipped with NVIDIA Jetson Nano
Features ■ Width 154 × Height 30 × Depth 101 mm, 0.467 liters ■ Nvidia Jetson Nano SOM fanless ■ Quad Core ARM A57 processor ■ 4GB LPDDR4 + 16GB Micro-SD or eMMC ■ LAN x 5 ■ 2 COM / 4 USB 3.0 / 1 MicroUSB (Flash OS) / 5 GbE ■ Operating temperature -20 to 60℃ ■ Wide DC input 10V to 24V ■ Vibration resistance 3grms
For embedded systems, equipped with 9th generation Xeon/Core i7/i5/i3, NVIDIA Quadro Embedded GPU can be installed.
Features ■ Width 165 × Height 210 × Depth 240 mm, 8.31 liters ■ Xeon E-2278GE/Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE CPU ■ NVIDIA Quadro Embedded P1000/P2000/P3000/P5000 GPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++1.2, 1 VGA/DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Expansion slot 1 PCIe[x4](MVP-6120-MXM) ■ Expansion slot 2 PCIe[x4] + PCI(MVP-6140-MXM) ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V
Intel Core i 3/5 equipped | Ultra-thin: 19mm | Fanless & cable-free | 0~40℃ | 19V | 2x HDMI
【Main Features of the Product】 ■ Powered by Intel Core i5-6300U/6200U and Core i3-6100U processors ■ Utilizes embedded/non-embedded processors to meet various application needs ■ 19mm thin chassis, ideal for installations with limited space ■ Dual HDMI display output with a resolution of 4096×2304 UHD ■ Fanless and cable-free design for easy maintenance ■ Expandability via internal Mini-PCIe interface (M-SATA compliant) ■ Supports WISE-PaaS/RMMR and embedded software APIs ■ Supports WebAccess/IMM for user-friendly signage content management, remote monitoring, and control
7th generation Core i7-7600U/i5-7300U/i3-7100U/Celeron 3965U CPU equipped
Features ■ Equipped with 7th generation Core i7-7600U/i5-7300U/i3-7100U/Celeron 3965U CPU. ■ Memory: 1867/2133MHz DDR4 SO-DIMM x2 (up to 32GB) ■ Supports 2x DDI (VGA), 1x LVDS (eDP), and 3 independent display outputs. ■ 6x PCIe [x1] (optional) ■ GbE, 3x SATA3 (6Gb/s), 4x USB3.0, 4x USB2.0 ■ Supports Smart Smart Embedded Management Agent (SEMA) functionality. ■ Extended operating temperature: -40℃ to +85℃ (optional)
SINTRONES, equipped with AMD Ryzen Embedded R2312 CPU, extended temperature support, fanless embedded PC.
**SINTRONES SBOX-2624(P) Features** - Dimensions: 150mm (W) x 65mm (H) x 150mm (D), approximately 1.46 liters - AMD Ryzen Embedded R2312 2C/4T CPU, fanless operation - 1 x SO-DIMM DDR4-2400 (up to 32GB) - 4K resolution support, 2 display outputs (2 HDMI) - 1 x M.2 3042/3052 Key B (supports USB 3.2, WWAN, Dual SIM) expansion slot - 1 x M.2 2230 Key E (supports PCIe/USB 2.0, Wi-Fi/Bluetooth) expansion slot - 1 x M.2 2280 Key M (supports NVMe/SATA SSD) - 1 x 2.5GbE (RJ45), 4 x GbE (RJ45), 2 x USB 3.2 Gen 2 (10Gbps), 2 x USB 2.0, 2 x RS-232/422/485, 2 x RS-232 - Operating temperature range: -30 to 60°C (with airflow) - OS: Windows 10, Windows 11, Ubuntu 20.04 - Railway standard EN50155 certified
AAEON Alder Lake-N / Amston Lake equipped industrial edge PC
Features ● Equipped with Intel N200 / N50 / Atom x7211E / x7433RE / x7213RE / x7211RE ● Supports DDR5 4800MHz SO-DIMM (N200 / N50 / Atom x7211E up to 16GB) (x7433RE / x7213RE / x7211RE up to 32GB) (sold separately) ● 2.5 GbE x2 ● M.2 2280 M-Key x1, M.2 2230 E-Key x1 ● USB 3.2 Gen 2 x2 ● Onboard TPM 2.0
NXP i.MX 6 Family, ARM Cortex-A9, onboard 1GB DDR3L, OS Yocto
Features ■ Processor based on NXP i.MX 6 Family with ARM Cortex-A9 cores ■ GC320 & GC355 2D accelerator + GC2000 3D accelerator ■ 2x 100MbE, up to 3x USB, 2x RS232, RS485, CAN ■ Onboard 1GB DDR3L ■ LVDS Single/Dual Channel connector, HDMI interface, 1x CAN (ISO/DIS 11898) ■ eMMC: 4 GB MLC, SD slot: 4 bit MMC/SDIO/SD/SDHC ■ 2x 100Mb Ethernet mPCIe (half size) socket for modems or WiFi/BT ■ 1x USB 2.0 OTG micro-AB, up to 2x USB 2.0 Type-A ■ 2x RS-232, RS-485, 1x speaker (connector) ■ OS Yocto ■ Size 159x18x80mm
C&T, equipped with 14th/13th generation CPUs Raptor Lake-S/Alder Lake-S, small computer.
[C&T BCO-3000-RPL Features] ■ Width 192 × Height 69 × Depth 340 mm, 4.50 liters ■ 14th/13th generation Core i9/i7/i5/i3 CPU (35W TDP) ■ 2x DDR4 SODIMM (up to 64GB) ■ 4K resolution support, 3 display outputs (2x DP, 1x HDMI) ■ 3x 2.5GbE (1225-V/1225LM/1225LV) ■ 1x M.2 B-Key, 1x M.2 E Key, 1x M.2 M Key ■ 2x RS-232/422/485, 2x RS-485 ■ 6x USB3.2 Gen2, 2x USB3.2 Gen1, 2x USB2.0 ■ Wide DC input 9–36V, AT/ATX mode ■ UL62368 ED.3 certification
C&T, equipped with 14th/13th generation CPUs Raptor Lake-S/Alder Lake-S, small computer
【C&T BCO-6000-RPL Features】 ■ Width 330 × Height 69 × Depth 340 mm, 5.46 liters ■ 14th/13th generation Core i9/i7/i5/i3 CPU (35W TDP) ■ 2x DDR4 SODIMM (up to 64GB) ■ 4K resolution support, 3 display outputs (2x DP, 1x HDMI) ■ 1x PCIe [x16] + 2x PCIe [x8] expansion slots ■ 3x 2.5GbE (1225-V/1225LM/1225LV) ■ 1x M.2 B-Key, 1x M.2 E Key, 1x M.2 M Key ■ 2x RS-232/422/485, 2x RS-485 ■ 6x USB3.2 Gen2, 2x USB3.2 Gen1, 2x USB2.0 ■ Wide DC input 9–36V, AT/ATX mode ■ UL62368 ED.3 certification
7th generation Core i7/i5/i3/Xeon CPU equipped, type 6 CPU module
Features ■ Equipped with 7th generation Intel Core i7/i5/i3/Xeon CPU. ■ Intel QM175 / HM175 / CM238 chipset (old codename: Kaby Lake) included. ■ Memory 2133/2400MHz DDR4 SO-DIMM x2 (up to 32GB) ■ Supports 3x DDI channels, 1x LVDS (eDP), and 3 independent display outputs. ■ 8x PCIe [x1] (Gen3), 1x PCIe [x16] (Gen3) ■ GbE, 4x SATA3 (6Gb/s), 4x USB3.0, 4x USB2.0 ■ Supports Smart Embedded Management Agent (SEMA) functionality. ■ Extended operating temperature: -40℃ to +85℃ (optional)
OPS compliant digital signage, equipped with AMD GX-224IJ/7th generation Core i7-7600U.
Features ■ Width 200 × Height 30 × Depth 119 mm, 0.72 liters ■ AMD GX-224IJ 2.4GHz APU ■ Open Pluggable Specification ■ AMD Radeon R4E Graphics ■ iSMART EuP/ErP power saving, auto-scheduling, power resume
AAEON Alder・Amston Lake Core i3/Atom/N series equipped embedded industrial fanless PC
Features: ● Equipped with Intel Processor N200 / N50 / Atom x7211E / x7433RE / x7213RE / x7211RE ● DDR5 4800MHz SO-DIMM (N200 / N50 / Atom x7211E supports up to 16GB) (x7433RE / x7213RE / x7211RE supports up to 32GB) (sold separately) ● 2.5GbE x 2 ● M.2 2280 M-Key x 1, M.2 2230 E-Key x 1 ● USB 3.2 Gen 2 (Type-A) x 2 ● Onboard TPM 2.0 ● Wide temperature range of -20 to 60℃
AAEON Google Edge TPU equipped compact fanless AI edge embedded PC
● Equipped with Google Edge TPU ML accelerator ● AutoML Vision Edge is available, making AI learning and development easy ● Equipped with NXP i.MX 8M SoC ● GbE PoE/PD x 1 ● USB3.2 Gen 1 x 2 & USB2.0 x 2 ● Mic-in & Line-out
Operating temperature 0℃ to +60℃! Low-end AMD Ryzen on COM Express Type 6 Compact.
"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.
