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Polishing Machine Product List and Ranking from 246 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. 松田精機 Hyogo//Manufacturing and processing contract
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 田中インポートグループ Osaka//others
  5. 5 null/null
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Polishing Machine Product ranking

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Manual Sample Grinder "IM-P2" [Made in Japan] アイエムティー
  2. Belt Grinder "Bader Machine" 松田精機
  3. Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  4. 4 Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing Machine Product List

496～510 item / All 798 items

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Chemical polishing device

Chemical polishing device

Equipped with a function to adjust the swing angle! It can maintain an even spray balance!

The "Chemical Polishing Device" is a product that roughens the surface of copper foil to improve the adhesion of laminates. The spray nozzle pipe can be switched between vertical and horizontal arrangements, allowing it to accommodate various product conditions. The oscillation of the chemical polishing section is equipped with a function to adjust the angle of the swing, in addition to speed adjustment through electric control, enabling the spray balance to be maintained evenly. 【Features】 ■ Renders the surface of copper foil rougher to enhance laminate adhesion ■ Accommodates various product conditions ■ The spray nozzle pipe can be switched between vertical and horizontal arrangements *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other surface treatment equipment

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Multi-stage finishing by a film-type NC super finishing machine super finisher.

Multi-stage finishing by a film-type NC super finishing machine super finisher.

Stable achievement of finishing surface precision below Rz0.8μ (Ra0.2μ) ■Industry: Automotive (prototype) / Semiconductor / Robotics

The film is retractable, allowing for continuous exposure of a new surface during polishing, achieving a finishing surface accuracy of Rz0.8μ (Ra0.2μ) or less consistently. Additionally, it can flexibly accommodate a variety of products through programming. 【Main Usage Examples】 Polishing of automotive parts (such as AT transmissions and shock absorbers) Polishing of crankshaft, camshaft, and seat surfaces of hydraulic and pneumatic valves Finishing polishing of painting rollers for printers and similar equipment Precision polishing of rollers for paper and film manufacturing and printing *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • Processing Contract

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Flap Wheel "KF Wheel" [Excellent Flexibility & Uniform Finish]

Flap Wheel "KF Wheel" [Excellent Flexibility & Uniform Finish]

Achieves good flexibility and a uniform finish! General flap wheel.

■For catalog downloads and inquiries, please visit the following URL and click on [Request Materials Here]. http://www.koyo-sha.co.jp/ KF wheels have a long product life and a consistent surface roughness, making them easy to automate. The air cooling effect helps to prevent burning of the workpiece while providing good "familiarity" with the shape, allowing for curved surface polishing. <Features> ■Moderate wear prevents clogging. ■Can be used as a substitute for emery buffs. ■Long product life and consistent surface roughness make automation easy. ■The air cooling effect helps to prevent burning of the workpiece. ■Good "familiarity" with the shape of the workpiece allows for easy curved surface polishing. ■Designed for dry use, offering great flexibility and achieving a more uniform finish. <Type-Specific Performance> ・DAK... A general type with a uniform finish that is easy to connect to the next process (for dry use). ・YWK... Performance that is intermediate between standard wheels and resin-bonded polishing cloth wheels (for dry use).

  • Other cutting tools

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"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly

Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly

We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.

IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A unified production system from design to assembly in-house - Speedy response: Detailed and prompt support *For more details, please download the materials or contact us directly.

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  • Wafer processing/polishing equipment

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Sample Grinding Machine 2-Stage Grinder "Eo2" [Made in Japan]

Sample Grinding Machine 2-Stage Grinder "Eo2" [Made in Japan]

High torque! Low price! Cute logo! A dual machine with triple grinding capabilities!

The "Eo2" is a two-disk device specifically designed for hand polishing. It features a table height that makes hand polishing easy, allowing for comfortable work. It is equipped with a motor that delivers strong torque even at high speeds and low ranges. It comes with two water supply taps and a drainage hose at the back. 【Disc Sizes】 ○ Polishing Disc: Φ223mm or Φ200mm ○ AL Polishing Disc: Φ200mm ○ Magnetic Surface Disc: Φ200mm For more details, please contact us or download the catalog.

  • Other physicochemical equipment

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Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan]

Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan]

Adopts an individual loading method! It is a sample polishing machine that allows grinding without losing parallelism.

The "Rana-3" adopts an individual load method and is a sample polishing machine that allows for the free setting of 1 to 6 samples. Since it is possible to change the holder rotation speed, the holder and disk can be polished at the same rotation speed, preventing the polishing surface from tilting or becoming pencil-shaped. Both the holder and disk can rotate in both forward and reverse directions. 【Features】 ○ Grinding can be performed without losing parallelism ○ Automatic increase and decrease of pressing force up to the set seconds ○ Three-stage variable polishing conditions (pressure/rotation speed) ○ Memory for 16 polishing conditions For more details, please contact us or download the catalog.

  • Other physicochemical equipment

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Surface grinding machine "Cyrex-G" with grinding stone.

Surface grinding machine "Cyrex-G" with grinding stone.

The grinding machine features an automatic dressing function for the grinding wheel, with a rotation speed of 800 to 1700 rpm!

We would like to introduce our surface grinding machine, 'Cyrex-G', which uses grinding wheels. It comes with a safety cover that protects the body from high-speed rotating objects, and the holder rotation speed ranges from 60 to 200 rpm. Additionally, it features a 50L tank for circulating cooling water. IMT, although small in scale, responds to customer requests with a consistent and meticulous "manufacturing" system and a sense of speed. 【Specifications (partial)】 ■ Power supply: Three-phase 200-220V 50/60Hz ■ Air: Requires an air source of 0.5MPa or more ■ Holder rotation speed: 60-200 rpm ■ Maximum sample holder diameter: φ200mm ■ Grinding wheel rotation speed: 800-1700 rpm *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

I'm graduating from hand polishing!

Every day after joining the company, I receive strict guidance on hand polishing from my supervisor. It's difficult to grind parallel, and it takes a whole day to finish just one piece. Colleagues from other departments often ask, "Why is that new employee standing there all day?" It's a bit tough... One day, I searched for sample polishing on Ipros and found IMT, which ranked first in the search results. When I requested information, a cheerful and friendly salesman came to see me right away and offered to help. He introduced me to the IM-P2 and SP-L1, providing detailed explanations. (For uses not listed in the catalog, please inquire.) I convinced my supervisor and got permission to conduct a demo of the IM-P2/SP-L1. [To be continued in the next part]

  • Wafer processing/polishing equipment

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Fully Automatic Grinding Machine "Cyrex" [Made in Japan]

Fully Automatic Grinding Machine "Cyrex" [Made in Japan]

Behold the fusion of 'Cyber' and 'T-Rex' - achieving high throughput through simultaneous polishing at each stage.

"Cyrex" is a fully automatic polishing machine equipped with a grinding stone stage, polishing and lapping stage, automatic dressing mechanism for the grinding stone, and grinding amount adjustment mechanism as standard features. It achieves high throughput through simultaneous polishing at each stage. Each stage is equipped with a cleaning tank and drying tank as standard, preventing contamination from foreign substances from previous processes. It can flexibly accommodate various customizations. 【Features】 - Adopts PLC control with high design flexibility - Each process is equipped with a head, significantly increasing productivity - Holder stock can be selected as either conveyor type or stacked type - Large polishing machine available in 3 to 6 series options - Capable of stocking a large number of sample holders For more details, please contact us or download the catalog.

  • Other physicochemical equipment

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Grinding device "Hot grinding device"

Grinding device "Hot grinding device"

Polishing is possible in a heated state. Guarantees the profile at the usage temperature.

Grinding Device "Hot Grinding Device" allows for grinding in a heated state. It guarantees the profile at the operating temperature. Non-circular grinding is possible with NC control. It is equipped with an automatic measuring device (supports up to φ1,000). 【Machine Specifications】 ○ Processing Size: φ1,400mm × 8,000mm (total length) ○ Maximum Weight: 35,000kg ○ Processing Temperature: MAX 250℃ (when using heat) → When using hot water, up to 200℃ For more details, please contact us or download the catalog.

  • Other surface treatment equipment

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Nanotech Corporation's "Comprehensive Catalog"

Nanotech Corporation's "Comprehensive Catalog"

Nanotech Co., Ltd.'s 'Comprehensive Catalog' that values creativity and ingenuity without being swayed by trends.

This is the "Comprehensive Catalog" of Nanotech Co., Ltd., which values creative ingenuity and continues research and development that is not swayed by trends. It includes a variety of coating devices capable of modifying DLC films for a wide range of applications, as well as coating services for the ICF series of high-performance films evolved from DLC, from small sample prototyping to mass production. For more details, please contact us or download the catalog.

  • Other processing machines
  • Testing Equipment and Devices
  • Processing Contract

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Film polishing sample test [For improving surface roughness accuracy!]

Film polishing sample test [For improving surface roughness accuracy!]

Are you having trouble improving the accuracy of surface roughness? Sample tests for film polishing are available!

Are you having trouble improving surface roughness accuracy? Would you like to try the benefits of film polishing? You can polish quickly and easily without the hassle of the fine touch required in grinding with grinding wheels! 【For example, in the following cases】 ■ You want to improve roughness accuracy without worrying about changes in diameter or height dimensions. ■ You have performed grinding with grinding wheels, but it is still insufficient. – Final polishing is needed! ■ You want to finish with film polishing, skipping the grinding wheel process from the turning marks. ■ You want to roughen a surface that is too smooth. ■ You want to remove foreign substances attached to the surface. ■ You have tried various methods but they haven't worked well. ■ Polishing new materials or thin items seems unlikely to succeed without film polishing. *For more details, please request materials or view the PDF data from the download.

  • Processing Contract

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Newly developed outer diameter grinding equipment and new technology for clogging prevention unveiled! Tape grinding demonstration as well.

Newly developed outer diameter grinding equipment and new technology for clogging prevention unveiled! Tape grinding demonstration as well.

Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging prevention!

A tape grinding device utilized in high-tech industries such as automotive and electronics. Sanshin, a professional in tape grinding devices, will exhibit at "JIMTOF2018," starting on November 1. On the day of the event, we will demonstrate tape grinding for ball screws and worms used in electric power steering for automobiles. Additionally, we plan to unveil a newly developed outer diameter grinding device and a new technology for clogging suppression using ultrasonic vibrations. 【Event Overview】 JIMTOF2018 Date: November 1 (Thursday) to November 6 (Tuesday), 2018 Venue: Tokyo Big Sight, East Hall 1 (Booth Number: E1073) 【Exhibited Products】 ■ Newly developed! Outer diameter grinding device FPM-D ■ New technology! Grinding tape clogging suppression technology ■ Tabletop outer diameter grinding machine SFT-D1 ■ Outer diameter grinding unit SFM-25R (50R) / R・L ■ Inner diameter grinding unit MFIL-12 ■ Ball screw and worm gear grinding device BSN500-LM *For more details, please request materials or view the PDF data from the download section.

  • Wafer processing/polishing equipment

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*Video now available! Outer diameter precision surface finishing machine 'SFM'*

*Video now available! Outer diameter precision surface finishing machine 'SFM'*

Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]

The "SFM" is a unit for precision grinding of shafts and similar components. It can be attached to lathes and allows for precision machining. Additionally, depending on the workpiece, the film width can be selected, enabling high-efficiency and low-cost processing. It is primarily introduced in the final finishing process of various automotive parts shafts and is suitable for improving the roughness of sliding and sealing areas. The outer diameter grinding unit can also be applied to grinding end faces and inclined surfaces. We offer a lineup of grinding units that can be attached to customer lathes and table-top grinding machines equipped with work rotation mechanisms. Furthermore, it can be used for both dry and wet processing, and the processing environment is clean and compact. 【Features】 - Achieves approximately 30% space-saving compared to conventional machines - Can obtain surface roughness according to purpose - Allows for precision finishing regardless of experience level - Capable of uniform finishing with a constantly new abrasive surface - Processing environment is clean and compact *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Engine parts
  • lathe

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