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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 チップトン Aichi//Manufacturing and processing contract
  5. 5 null/null

Polishing machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  3. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  4. 4 Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing machine Product List

721~735 item / All 812 items

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[Research Material] The Global Market for Chocolate Wrapping Film

Global Market for Chocolate Wrapping Films: PET, PVC, BOPP, Others, White Chocolate, Dark Chocolate, ...

This research report (Global Chocolate Wrapping Films Market) investigates and analyzes the current status and outlook for the global market of wrapping films for chocolate over the next five years. It includes information on the overview of the global chocolate wrapping films market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the chocolate wrapping films market by type include PET, PVC, BOPP, and others, while the segments by application focus on white chocolate, dark chocolate, and milk chocolate. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for chocolate wrapping films. It also includes the market share of major companies in the chocolate wrapping films sector, product and business overviews, and sales performance.

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[Research Material] World Market for Chemical Mechanical Polishing Equipment

World Market for Chemical Mechanical Polishing Equipment: 300mm, 200mm, 150mm, Others, Integrated Device Manufacturers (IDM), Foundries, Others

This research report (Global Chemical-Mechanical Planarization Equipment) investigates and analyzes the current state and outlook for the global market of chemical-mechanical planarization equipment over the next five years. It includes information on the overview of the global chemical-mechanical planarization equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include 300mm, 200mm, 150mm, and others, while the segments by application focus on integrated device manufacturers (IDM), foundries, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of chemical-mechanical planarization equipment. The report also includes the market share of major companies in the chemical-mechanical planarization equipment sector, product and business overviews, and sales performance.

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Single-Sided Lap Grinding Machine "HIT-36L-3R"

We have considered ease of use with a simple design that is necessary and minimal.

The "HIT-36L-3R" is a one-sided lap grinding machine that excels in operability and maintainability. It employs a mechanism that allows for the easy attachment and detachment of the base plate using a center bolt, making it simple to replace and clean the base plate. Additionally, by adopting an optional forced drive and oscillating drive mechanism, it enables stable rotation of the workpiece, stable management of the base plate's flatness, and improvement of the workpiece's flatness. 【Table Specifications】 ■ Target Workpiece: Maximum outer diameter of approximately Φ350mm ■ Usable Table Diameter: Φ910mm without water cooling mechanism ■ Processing Axis: 3-row revolving guide rollers ■ Table Rotation Electric Motor: AC200V 3-phase 2.2kw inverter motor ■ Table Rotation Speed: Stepless variable speed 10 to 60 rpm, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Cylindrical grinding machine for SiC

Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!

Based on the technology cultivated with silicon cylindrical grinding machines, we developed a cylindrical grinding machine for SiC. SiC, which is expected to be the next-generation power semiconductor, has a high processing difficulty, and we have overcome many challenges to complete it as production equipment.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Flap wheel

Various types such as those with shafts and slits! Introducing our "flap wheels."

A "flap wheel" is a product that consists of abrasive cloth bundled and fixed in a radial pattern. It has a long product life, allows for continuous grinding, and is suitable for automation. Due to its self-generating action, it does not clog, and the roughness of the grinding surface remains unchanged from the beginning to the end of use. Please feel free to contact us when you need assistance. 【Materials Handled】 ■ Abrasive cloth *For more details, please refer to the related links or feel free to contact us.

  • Other abrasives

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Tabletop Precision Grinding Device

This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.

We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)

  • CMP Equipment

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OTEC / Desktop Polishing Device for Dental Use Maxi Dental

A tabletop-sized polishing device ideal for small lot production.

Maxidental is a tabletop-sized polishing device ideal for small lot production. In Europe, it is used in the polishing processes for various applications such as night guards, surgical plates, and non-clasp dentures. ◼ Perfect for aligners and non-clasp dentures ◼ Can process about 5 pieces simultaneously ◼ Total of approximately 2 hours for 2 processes (rough and finishing) ◼ Two process containers for wet use ◼ Compact design in tabletop size ◼ Features a simple recirculating drainage system

  • Maxi Dental4圧縮.jpg
  • Other measurement, recording and measuring instruments

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