Layered, abrasion-resistant material layered cushion pad
Available for use in the lamination process of printed circuit boards and FPC boards (high-temperature pressing)!
The laminated cushion pad is specially designed as an alternative to traditional craft paper for the lamination process (high-temperature pressing) of printed circuit boards and FPC boards. The product is composed of laminated silicone glass fiber reinforcement, demonstrating excellent shock absorption capability and high-pressure durability during the manufacturing process. The thick, rigid surface excels in abrasion resistance and chemical reaction resistance. Products are available in various dimensions and thicknesses in two standard colors. For more details, please contact us or refer to the catalog.
- Company:コールトロール
- Price:Other