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Resin(pa) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Mar 11, 2026～Apr 07, 2026
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Resin Product List

151～180 item / All 205 items

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Thermoplastic polyimide Therplim

Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Low viscosity UV-curable resin TRU-0201K

Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

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UV-curable resin, high strength type TRU-0212

UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

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LM Series

LM Series

Index from 1.43 to 1.415! Complementing conventional high elasticity MY-145 and others.

We would like to introduce the "LM Series" that we handle. Our lineup includes "LM-136-EA" with an elastic modulus of 17 MPa, "LM-142-NI" with 28 MPa, and "LM-144" with 21 MPa. A low elastic modulus reduces stress during thermal cycles, making it advantageous for very high-power strippers. 【Specifications (partial)】 ■LM-136-EA ・Refractive index (589nm): 1.369 ・Refractive index (950nm): 1.363 ・Curing method: UV ・Adhesive strength (g/cm): 225 ・Viscosity (CPS): 1700 *For more details, please refer to the related links or feel free to contact us.

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Polystyrene resin "PSJ-Polystyrene G9001"

Polystyrene resin "PSJ-Polystyrene G9001"

Like regular GPPS, it can be molded by injection and extrusion! It is a heat-resistant grade product.

"PSJ-Polystyrene G9001" is a transparent heat-resistant styrene-based copolymer with a Vicat softening temperature approximately 15°C higher compared to high heat-resistant GPPS. Like regular GPPS, it can be processed by injection and extrusion molding. It is recommended for applications that require heat resistance, such as microwave containers. For more details about other products, please contact us. 【Features】 ■ Heat-resistant grade ■ Has heat resistance between GPPS and polycarbonate ■ Approximately 15°C higher Vicat softening temperature compared to high heat-resistant GPPS *For more details, please refer to the PDF document or feel free to contact us.

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[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

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Precision machining of PEEK resin [TECAPEEK ST black]

Precision machining of PEEK resin [TECAPEEK ST black]

We accept precision machining of Ensinger's PEEK resin TECAPEEK ST black, from small lots of 1 piece to mass production!

"TECAPEEK ST black" is a heat-resistant resin that surpasses PEEK and is one of the polyaryletherketones (PAEK). Due to its high glass transition temperature, strength, and hardness, it exhibits excellent mechanical properties even when exposed to high temperatures. It has higher wear resistance, compression strength at high temperatures, and load deflection temperature than PEEK and PEK, and can be used while maintaining mechanical properties at temperatures 40°C higher than standard PEEK grades. [Features] - Excellent heat resistance and mechanical strength - Very good chemical resistance - Good machinability - Good load deflection temperature (DTUL, HDT) - Low moisture absorption - Excellent dimensional stability *For more details, please download the PDF or feel free to contact us.

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Precision machining of PEEK resin [TECAPEEK natural]

Precision machining of PEEK resin [TECAPEEK natural]

We accept processing of Ensinger's PEEK resin TECAPEEK natural. We have a large inventory. From small lots of 1 piece to mass production!

"TECAPEEK natural" is a PEEK material made using Victrex PEEK 450. It is a well-known and important high-performance crystalline resin among PAEK types, featuring excellent mechanical strength and wear resistance, as well as outstanding chemical resistance and heat resistance (long-term heat resistance: 260°C, short-term heat resistance: 300°C), making it suitable for parts subjected to high stress loads. Due to its excellent dimensional accuracy and creep resistance, it can also be used for precision components. 【Features】 ■ Good load deflection temperature (DTUL, HDT) ■ Good machinability ■ Flame retardant ■ High energy radiation (gamma, X-ray) resistance ■ Good sliding properties and wear characteristics ■ High creep resistance *For more details, please download the PDF or feel free to contact us.

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

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General-purpose potting resin TE-6302 low viscosity/high strength product

General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

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Epoxy resin 'EPOX MK SR35K/SR3542'

Epoxy resin 'EPOX MK SR35K/SR3542'

Rubber-modified solid epoxy resin with excellent film elongation and film-forming properties.

We offer a solid epoxy resin with improved flexibility and impact resistance, known as 'EPOX MK SR35K/SR3542', which is formulated with modified rubber. In addition to the rust prevention and chemical resistance properties of epoxy resin, it excels in film elongation and film formation due to rubber modification. Please feel free to contact us if you have any inquiries. 【Basic Physical Properties】 ■Flexural Strength: 114 MPa ■Flexural Modulus: 4890 MPa ■Growth Rate: 20% ■TG: 94℃ *For more details, please download the PDF or contact us.

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[New Development] One-component Heat-Curing Epoxy Resin TE-5018

[New Development] One-component Heat-Curing Epoxy Resin TE-5018

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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Impregnation sealant "PMS-50E"

Impregnation sealant "PMS-50E"

Imparting waterproof and sealing properties to plastic molded products and sensor components. A sealing method different from potting and O-rings!

The "PMS-50E" is a sealant suitable for filling gaps in plastic molded products and gaps in products where sensors are molded with resin. Even if there are no gaps during molding, gaps can occur due to thermal shock during use, which can lead to larger gaps. It is also possible to suppress the occurrence and growth of such gaps. Additionally, "PMS-50E" has high chemical resistance, making it highly reliable even around engines and in oil. "PMS-50E" can also be applied to metal parts such as powder metallurgy and cast die-cast. In this case, it demonstrates superior performance in heat resistance, sealing properties, and chemical resistance compared to other impregnants we offer. 【Basic Physical Properties】 ■ Material Acrylic resin ■ Heat Resistance -40℃ to 204℃ 【Target Materials】 ■ Super engineering plastics such as PPS and PEEK ■ Engineering plastics such as PA6, PA66, POM, and PBT ■ Powder metallurgy ■ Castings ■ Die-cast ■ MIM ■ Pressed powders

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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[Research Material] World Market for PVC Paste Resin

[Research Material] World Market for PVC Paste Resin

World Market for PVC Paste Resin: Micro-suspension Method, Emulsion Method, PVC Gloves, Artificial Leather, Automotive Interiors, Wallpaper, Plastic Flooring, Paints and Coatings ...

This research report (Global PVC Paste Resin Market) investigates and analyzes the current state and outlook for the global PVC paste resin market over the next five years. It includes information on the overview of the global PVC paste resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the PVC paste resin market focus on micro-suspension and emulsion methods, while the segments by application cover PVC gloves, artificial leather, automotive interiors, wallpapers, plastic flooring, paints and coatings, and others. The regional segments calculate the market size of PVC paste resin by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the PVC paste resin market, product and business overviews, and sales performance.

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[Research Material] Global Market for Transparent ABS for Home Appliances

[Research Material] Global Market for Transparent ABS for Home Appliances

Global Market for Transparent ABS for Home Appliances: General Purpose, Impact Resistant, High Rigidity, Television, Washing Machine, Refrigerator, Others

This research report (Global Transparent ABS for Household Appliances Market) investigates and analyzes the current status and outlook for the global market of transparent ABS for household appliances over the next five years. It includes information on the overview of the global transparent ABS market for household appliances, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the transparent ABS market for household appliances include general-purpose, impact-resistant, high rigidity, and others, while the segments by application cover televisions, washing machines, refrigerators, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size for transparent ABS for household appliances. It also includes the market share of major companies in the transparent ABS market for household appliances, product and business overviews, and sales performance.

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[Market Report] Global Market for C5 Resins

[Market Report] Global Market for C5 Resins

The global market for C5 resin is projected to exceed 1.1 billion USD by 2031, driven by versatile applications.

The global C5 resin market, valued at approximately 800 million USD in 2022, continues to rise steadily and is projected to reach 1.1 billion USD by 2031. This promising growth trajectory is supported by the exceptional versatility of C5 resins across various industries and applications. The growth of the C5 resin market reflects its essential role in several key industries. As industries prioritize product quality, performance, and sustainability, C5 resins are poised to remain at the forefront of material innovation. For application methods, please check the [PDF download] button or apply directly through the related links.

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PEEK resin processing TECAPEEK ELS CF30 black

PEEK resin processing TECAPEEK ELS CF30 black

We accept machining of Ensinger's PEEK resin TECAPEEK ELS CF30 black, from small lots of 1 piece to mass production!

"TECAPEEK ELS CF30 black" is a conductive PEEK material with 30% carbon fiber added, developed as a solution for applications requiring high rigidity while maintaining consistent conductivity. The special carbon fiber filler system of this product combines the advantages of improved mechanical strength and a stable surface resistivity of 10^2 to 10^4 Ω/sp. Furthermore, the carbon fiber modified material exhibits less wear compared to glass fiber modified materials, and its friction and wear characteristics are also improved. 【Features】 ■ Good load deflection temperature (DTUL, HDT) ■ Good chemical resistance ■ Flame retardant ■ Hydrolysis resistance and steam heating resistance ■ Very high rigidity ■ Very high creep resistance *For more details, please download the PDF or feel free to contact us.

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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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Impregnating sealant "5100"

Impregnating sealant "5100"

Seal the gaps inside the electric wires and wire harnesses. A new sealing method to replace O-rings and potting.

"5100" is a sealant suitable for sealing gaps inside electric wires, wire harnesses, and similar applications. It maintains flexibility even after curing, making it suitable for sealing gaps in molded parts of connectors and sensors. Have you ever experienced oil or humid air leaking through gaps inside a wire harness? Or have you encountered situations where the insulation was damaged during use, allowing water to enter? In such scenarios, our impregnating liquid "5100" demonstrates high reliability. Additionally, "5100" retains high flexibility even after curing. Due to the differences in thermal expansion coefficients between resin and metal molded products, gaps can significantly shift when subjected to thermal shock. Even in such cases, "5100" moves with the shifting gaps, helping to minimize their occurrence. 【Basic Properties】 ■Material Acrylic resin ■Heat Resistance -40℃ to 150℃ 【Target Materials】 ■Fluoropolymer wires ■Cross-linked polyethylene wires ■Super engineering plastics such as PPS and PEEK ■Engineering plastics such as PA6, PA66, POM, and PBT

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

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Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

What non-metal materials are required for the development of lightweight hydrogen containers at high pressures of 70 MPa!?

High-Pressure Hydrogen Tanks for Fuel Cell Vehicles: R&D, Safety Inspection, Regulatory Trends, etc. ★Will regulatory relaxation be implemented as a national policy!? What non-metallic materials are required for the development of lightweight hydrogen containers at 70 MPa!? 【Venue】 Kawasaki City International Exchange Center, 2nd Floor, Conference Room 5【Kanagawa, Kawasaki】 Date and Time August 23, 2013 (Friday) 11:00-16:00

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Resin

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