There are proven applications for waterproof and dustproof smartphones and tablets in the domestic market! The hot melt sealing material has been upgraded!
The Asahi Tack SG series is a non-reactive hot melt sealing material that possesses the workability of hot melt adhesives and provides heat resistance. Furthermore, it has excellent flexibility, sealing properties, and ease of peeling that are not found in conventional hot melts, and it has been developed as a hot melt sealing material aimed at replacing various molded gaskets.
【Features】
- Automation of the fitting of molded materials can be achieved, allowing for cost reduction by replacing reactive curing adhesives.
- Its flexible and easily recoverable performance exerts a sealing effect by compressing the materials.
- After use as a sealing material, the substrates can be easily separated, enabling the recycling of the substrates. Additionally, it can be peeled off just a few seconds after application.
- It can be applied precisely according to the work shape using robots.
- It is designed for fine application.
- It can be adapted for electronic material housings that require waterproofing and dustproofing, with proven performance meeting IPX8 standards.
*For more details, please contact us or download the PDF.
