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Substrate(Laser) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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Substrate Product List

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Rich experience in embedded products for medical and special environments. Widely adopted by universities and research institutions! Simple mock-up production available. *Case study materials are currently being distributed.

At Stay Electronics Co., Ltd., we are engaged in the design, development, manufacturing, and sales of flexible printed circuits (FPC). We are equipped with prototyping facilities such as UV-YAG laser systems and cutting plotters, as well as inspection equipment like image dimension measuring instruments, allowing us to provide consistent support from design to prototyping, manufacturing, and inspection. With extensive manufacturing experience in FPCs for medical devices, we maintain a wide range of materials in stock and can flexibly respond to and propose solutions for customer requests under special conditions. ★ We also respond to requests for mock-up production! Whether it's challenges that other companies couldn't solve, stalled projects, or if you have never used flexible circuits before and just want to grasp the concept, please feel free to contact us for inquiries and consultations. 【Examples of Flexible Circuit Board Development】 ◎ FPC for ultrasound diagnostic probes ◎ FPC for superconducting devices operating at -269°C ◎ FPC for motor field winding ◎ FPC for ATM security monitoring, among others *Some development examples can be viewed via "PDF Download." Please feel free to reach out for inquiries.

  • Printed Circuit Board

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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BeagleBone Black PoE/PSE board

BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).

  • Embedded Board Computers

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BeagleBone Black PoE/PSE board

BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).

  • Embedded Board Computers

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

  • others

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Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)

Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.

  • Glassware and containers
  • Other inspection equipment and devices
  • Other consumables

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