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Substrate(art) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
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Substrate Product List

61～67 item / All 67 items

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[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

World Market for Active Metal Brazing (AMB) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), ...

This research report (Global Active Metal Brazed (AMB) Substrates Market) investigates and analyzes the current state and future outlook of the global active metal brazed (AMB) substrates market over the next five years. It includes information on the overview of the global active metal brazed (AMB) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the active metal brazed (AMB) substrates market by type include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and others, while the segments by application cover power electronics, automotive electronics, home appliances, aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of active metal brazed (AMB) substrates. It also includes the market share of major companies in the active metal brazed (AMB) substrates market, product and business overviews, and sales performance.

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[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

World Market for FPC (Flexible Printed Circuit Boards): Single-sided Circuits, Double-sided Circuits, Multi-layer Circuits, Rigid-flex Circuits, Medical, Aerospace & ...

This research report (Global FPC Market) investigates and analyzes the current state of the global market for FPC (Flexible Printed Circuit Boards) and its outlook for the next five years. It includes information on the overview of the global FPC market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the FPC market by type include single-sided circuits, double-sided circuits, multilayer circuits, and rigid-flex circuits, while the segments by application cover medical, aerospace & defense/military, consumer electronics, automotive, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FPC (Flexible Printed Circuit Boards). It also includes the market share of major companies in the FPC (Flexible Printed Circuit Boards) sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Semiconductor and IC Packaging Materials

[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Automotive Industry ...

This research report (Global Semiconductor & IC Packaging Materials Mark) investigates and analyzes the current state and future outlook of the global semiconductor and IC packaging materials market over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, and ceramic packages, while the segments by application cover the automotive industry, electronics industry, telecommunications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor and IC packaging materials. It also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

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[Research Material] Global Market for Semiconductor and IC Packaging Materials

[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Solder Balls ...

This research report (Global Semiconductor and IC Packaging Materials Market) investigates and analyzes the current state and future outlook of the global market for semiconductor and IC packaging materials over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, ceramic packages, solder balls, and others, while the segments by application cover the electronics industry, medical, automotive, telecommunications, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for semiconductor and IC packaging materials. The report also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

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[Research Material] Global Market for Display Glass Substrates

[Research Material] Global Market for Display Glass Substrates

Global Market for Display Glass Substrates: LCD Display Type, LED Display Type, OLED Display Type, Television, Computer ...

This research report (Global Glass Substrates for Displays Market) investigates and analyzes the current status and outlook for the global market of glass substrates for displays over the next five years. It includes information on the overview of the global glass substrates market for displays, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments for glass substrates for displays by type include LCD display type, LED display type, and OLED display type, while the segments by application cover televisions, computers, smartphones, tablet devices, automobiles, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for glass substrates for displays. The report also includes the market share of major companies in the glass substrates for displays market, product and business overviews, and sales performance.

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[Research Material] Global Market for Alumina DBC (DBC Substrates)

[Research Material] Global Market for Alumina DBC (DBC Substrates)

World Market for Alumina DBC (DBC Substrates): Alumina 96%, Others, Power Electronics, Automotive Electronics, Home Appliances & C ...

This research report (Global Alumina DBC (Direct Bond Copper Substrate)) investigates and analyzes the current state and future outlook of the global alumina DBC (DBC substrate) market over the next five years. It includes information on the overview of the global alumina DBC (DBC substrate) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type for alumina DBC (DBC substrate) focus on alumina 96% and others, while the segments by application cover power electronics, automotive electronics, home appliances & CPV, aerospace & others. The regional segments calculate the market size of alumina DBC (DBC substrate) by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the alumina DBC (DBC substrate) sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Glass Fiber Electrical and Electronic Products

[Research Material] Global Market for Glass Fiber Electrical and Electronic Products

Global Market for Glass Fiber Electrical and Electronic Products: CFRP, GFRP, Others, Printed Circuit Boards (PCB), Insulators and Enclosures, Others

This research report (Global Fiberglass Electrical and Electronic Products) investigates and analyzes the current state and outlook for the global market of fiberglass electrical and electronic products over the next five years. It includes information on the overview of the global fiberglass electrical and electronic products market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include CFRP, GFRP, and others, while the segments by application focus on printed circuit boards (PCB), insulators/enclosures, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of fiberglass electrical and electronic products. It also includes the market share of major companies in fiberglass electrical and electronic products, product and business overviews, and sales performance.

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