更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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![Industrial COM Express Module [HPC-RPSC]](https://image.mono.ipros.com/public/product/image/160/2001113181/IPROS14086677527159452284.jpg?w=280&h=280)
AAEON 12th/13th Generation HPC Client Size C Standard Industrial COM Express Module
Features ● DDR5 4800 MHz SO-DIMM x2 (up to 64GB) ● USB 2.0 x8, USB 3.2 x6 ● PCIe [x1] x8, PCIe [x4] x3, PEG [x16] x1 ● Intel I226-LM 2.5GbE x2 ● M.2 2280 M-Key x1 ● COM HPC Client Type, Size C (160 x 120mm)
Provides high-contrast images even in dark environments! Suitable for use in a wide range of industrial applications.
The "EoSens 2.0CXP2" is equipped with a high-speed CMOS sensor, providing outstanding speeds of 2,220 fps at a full HD resolution of 1,920×1,080 pixels. It leverages the advantages of the new CoaXPress Standard version 2.0, which transmits data at double the data rate of version 1.1. The camera's CXP-12 interface supports data transmission of up to 12.5 Gbps across a maximum of 4 lanes. 【Features】 ■ 2 megapixel resolution at 2,220 fps ■ Up to 170,500 fps at lower resolutions ■ High sensitivity ■ Faster CoaXPress V2.0 interface ■ Compact size of 80×80×53mm *For more details, please refer to the PDF document or feel free to contact us.
![Industrial COM Express Module [COM-R2KC6]](https://image.mono.ipros.com/public/product/image/bff/2001113183/IPROS17898489303591124218.jpg?w=280&h=280)
AAEON AMD Ryzen R2000 Type6 Compact Size Industrial COM Express Module
Features ● DDR4 3200MHz SO-DIMM x2 (up to 32GB) ● USB2.0 x8, USB3.2 10Gbps x2, USB3.2 5Gbps x1 ● PCIe [x4] x1, PCIe [x1] x4, PEG [x4] x1 ● Intel I226-LM/IT 2.5GbE x1 ● COM Express Type 6 (95 x 95mm)
It is possible to easily build an advanced AI image processing system with just one camera.
Equipped with a high-quality CMOS sensor and an AI chip that exceeds 10 TOPS, surpassing GPUs! It supports mainstream deep learning networks created with machine learning frameworks such as TensorFlow and Caffe, including MobileNET, YOLO, ResNET, and VGG, making it suitable for machine vision systems across various industries, fields, and domains. It is ideal for appearance defects, flaw detection, and quality inspection.
Ideal for machine vision. Ultra-compact and lightweight (27g). Snapshot-type multi-hyperspectral camera.
■USB3.0 Vision. Ideal for machine vision. ■Snapshot type. Capable of acquiring spectral data at video rates. ■Wavelength range: VIS (460–600 nm) / RedNIR (600–870 nm) / NIR (660–960 nm) ■Ultra-compact: 26 x 26 x 31 mm, ultra-lightweight: 27 g
A high-resolution and high-speed NIR camera equipped with a CMOS sensor that enhances near-infrared sensitivity.
■Features This is a 25MP near-infrared (NIR) camera equipped with a model that enhances the near-infrared sensitivity of Gpixel's CMOS sensor "GMAX0505," capable of capturing images at up to 150fps with CXP-12×4Lane output. With a 1.1-inch image size and a 2.5×2.5μm pixel sensor, it supports C-mount while providing high resolution. The resolution is 5,120×5,120 square pixels, combining high resolution, speed, and miniaturization to meet the demands for compactness, speed, and high pixel count. The incorporation of an Ultra Low Power FPGA and excellent design technology has achieved a compact housing with a 70mm square size, resulting in low power consumption and excellent heat dissipation, allowing for use without cooling fans or heat sinks. It is also equipped with mounting taps on the front and four sides, delivering excellent performance for various applications in factory automation. It can be utilized in a wide range of fields, including surveillance systems, food, and medical applications, where high-speed and high-pixel near-infrared imaging is required.
AAEON Industrial PICO-ITX Standard CPU Board ARM NXP i.MX8M Plus Quad-Core Cortex-A53
Features: ● ARM NXP i.MX8M Plus Quad-Core Cortex-A53 1.6GHz (NPU: 2.3 TOPs) ● 2G/4G onboard memory ● 16G/32G onboard eMMC storage ● HDMI 2.0 x 1, LVDS x 1, GbE x 2, USB 3.0 Gen 1 x 2, USB 2.0 x 1 ● COM x 2, CAN x 2, TPM 2.0 (model 0002 only), GPIO x 8 ● M.2 2230 E-key x 1, full-size mini card x 1 ● Standard product comes with Debian 11 (without GUI) ● Can support Debian 11 (with GUI), Android 13, Win 10 IoT, Yocto on a project basis
DB3588V2 – RK3588 Development Kit
The Geniatech DB3588V2 AI development board is equipped with the RockChip RK3588 chip and a 6Tops NPU, designed to comply with commercial and industrial standards, offering a supply period of over 10 years and comprehensive technical information. It supports multiple operating systems, provides powerful performance, stable and reliable product support, and offers high scalability to accommodate various AI application scenarios.
Introducing a 21-megapixel CoaXPress-over-Fiber (CoF) camera that supports image transmission at up to 100 Gbps!
CoaXPress-over-Fiber (CoF) is an interface that supports transmission via optical fiber as an extension of the existing CoaXPress specification. The "VCC-21CoF2" series, which adopts CoF, enables ultra-high-speed image transmission of up to approximately 526 fps through a single QSFP28 (100G) connection, despite its high resolution of 21 million pixels, thereby improving work efficiency in applications such as machine vision. 【Benefits of CoF】 ■ Ultra-fast image transmission with a wide bandwidth Maximum bandwidth of 5,000 MB/s from the camera to the host PC memory. ■ Cable length Fiber connections essentially have no limitations on cable length, allowing for flexible cable routing tailored to customer applications. Additionally, the cables are lighter and more compact than CoaXPress coaxial copper cables. ■ Standardized by JIIA and IEEE CoF is already offered by various companies as a connection option, making it widely available and easier for customers to find low-cost solutions that fit their needs.
Introducing a 21-megapixel CoaXPress-over-Fiber (CoF) camera that supports image transmission at up to 425 fps!
CoaXPress-over-Fiber (CoF) is an interface that supports transmission via optical fiber as an extension of the existing CoaXPress specifications. The "VCC-21CoF1" series, which is the first to adopt CoF from CIS, enables ultra-high-speed image transmission of 425 fps with a high resolution of 21 million pixels by using QSFP+ (40G) ×2, thereby improving work efficiency in applications such as machine vision. 【Benefits of CoF】 ■ Ultra-fast image transmission with a wide bandwidth Maximum bandwidth of 5,000 MB/s from the camera to the host PC memory. ■ Cable length Fiber connections essentially have no limitations on cable length, allowing for flexible cable routing tailored to customer applications. Additionally, the cables are lighter and more compact than CoaXPress coaxial copper cables. ■ Standardized by JIIA and IEEE CoF already has various connection options provided by different companies, making it widely available and easier to find low-cost solutions that fit customer applications.
We provide a complete set of the skeletal tracking software LIPSense, 3D Body Pose SDK, compatible 3D camera, and a pre-configured PC.
[1] LIPSense 3D Body Pose SDK, software capable of 3D skeletal tracking [2] Compatible 3D cameras [3] A complete set including a PC with [1][2] set up, delivered as a "turnkey system ready to use upon arrival." It is intended for the operation of real-time applications such as edge AI devices. ■ Skeletal tracking software "LIPSense 3D Body Pose SDK" It detects joints at 18 points on the body and can track the skeleton of up to 10 people simultaneously. Body tracking using a 3D camera can be performed with fewer sensors, providing high degrees of freedom in movement and tracking accuracy. In addition to the 3D cameras manufactured by LIPS Corporation, the standard Intel RealSense series can also be used. ■ Example of compatible 3D cameras LIPSedge AE series (AE400 / AE450) Intel RealSense D400 series (D415 / D435 / D435i / D455) LIPSedge DL, etc...
See3CAM_CU40 (manufactured by e-con Systems) 【equipped with OmniVision OV4682 sensor】
The "See3CAM_CU40" is a high-performance 4MP USB 3.0 UVC camera equipped with an S-mount (M12 mount) lens holder. This product is based on the Omnivision OV4682 CMOS image sensor, which supports the common RGB-IR format, and consists of two boards: the camera sensor board "e-CAM40_CUMI4682_MOD" and the USB 3.0 UVC controller board. It supports high frame rates via a 4-lane MIPI CSI-2 interface, and when connected to a host PC via USB 3.0, the "See3CAM_CU40" can stream at 672x380 @ 300fps, HD @ 90fps (720p90), and FHD @ 40fps (1080p40) in 10-bit RAW data format. Similarly, it can stream uncompressed 2688x1520/14fps in 10-bit RAW data format. It is a UVC-compliant USB 3.0 Super Speed camera, compatible with USB 2.0 host ports, and does not require the installation of special camera drivers on the host PC.
A smart body that blends into the scene.
A fixed model that blends seamlessly into its surroundings, capturing any areas of interest without missing a beat. Equipped with an infrared lens, it performs well in darkness and can monitor 24 hours a day. Compatible with IEEE802.11b/g/n wireless (Wi-Fi). It can be installed in locations far from the router or where laying LAN cables is difficult, allowing for flexible placement. 【Features】 ■ Easy connection and setup with Plug&Play ■ Compatible with IEEE802.11b/g/n wireless (Wi-Fi) ■ Built-in microphone and speaker ■ PIR sensor detects moving human bodies (heat sources) within approximately 7 meters ■ Capable of repeated recording and playback on microSD cards or NAS
AAEON AI development kit with 11th generation Core i7/i5, pre-installed with Ubuntu 20.04, Open VINO, and other software.
Features: ● Equipped with 11th generation Tiger Lake Intel(R) Core(TM) i7/i5 ● 16-pin GPIO connector x 1 ● 2.5Gbps LAN x 1 + 1Gbps LAN x 1 ● 8GB memory with 2 modules ● 128GB SATA SSD ● USB4.0 compatible ● M.2 2280 M key x 1, M.2 2230 E key x 1, M.2 3052 B key x 1 ● AI module equipped models available (UPX-EDGE-TGLI5-16128-FDAI, UPX-EDGE-TGLI7-16128-FDAI) For more details, please refer to the datasheet.
