We have a track record of approximately 300 million deliveries with zero external complaints. We would like to introduce our series of light-receiving elements that you can use with confidence.
This is a series of ultra-thin light-emitting devices that are among the thinnest in the industry. It features three main characteristics, achieving high quality, durability, and reliability.
1. High durability achieved with a palladium-plated frame. Typically, products are plated after completion, but post-completion plating can lead to quality issues due to the intrusion of plating solution. Our products use pre-plating, eliminating this risk.
2. No quality degradation due to material oxidation with low-temperature assembly. Low-temperature rapid curing die bonding ensures high adhesion between the chip, frame, and resin. Additionally, high bonding quality is achieved by preventing frame oxidation and reducing impurities, eliminating quality degradation due to material oxidation.
3. Adoption of highly reliable resin/structure. High-reliability molded resin, void-free molding under reduced pressure, and a double-structured package prevent quality degradation.
4. Stable operation even in high current regions due to the use of epitaxial wafers. The adoption of epitaxial wafers results in a Vce(sat) that is approximately 40% lower compared to competitors, ensuring stable operation even in stepped current regions.
*If you have any concerns, please feel free to contact us.
- Company：島田電子工業
- Price：Less than 10,000 yen
