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etching(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

etching Product List

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Horizontal PCB Etching System | Höllmüller by TSK

Horizontal PCB Etching System | Höllmüller by TSK

Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.

The Höllmüller ETCH by TSK Schill is a premier horizontal etching solution specifically engineered for high-end PCB and PCM (Photochemical Machining) production. It is designed to handle the most rigorous requirements for fine-line circuit formation. The system’s defining feature is the proprietary VACU-Etch technology. By optimizing fluid dynamics and using a vertical oscillation spray system, it physically eliminates the "puddle effect" (chemical stagnation) on the substrate surface. This allows for a perfectly uniform etch across the entire panel, enabling stable mass production of 1-mil (25μm) line/space definitions. Built with a robust 15mm thick polypropylene (PP) structure, the Höllmüller ETCH provides exceptional chemical resistance and thermal stability. It is the definitive choice for manufacturers of HDI boards, IC substrates, and high-precision metal parts who cannot compromise on yield or quality.

  • Etching Equipment
  • etching

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Photo etching

Photo etching

Microfabrication is possible from small-scale prototypes. Photo-etching.

◎ Prototyping available from a single piece ◎ Consistent process from thin film formation ◎ Prototyping for dicing, bump formation, etc. also available ◎ Patterning of dielectric films and multilayer films possible with lift-off processing ◎ Substrate size can be customized ◎ Etching of Si wafers and glass substrates is also possible ◎ Short delivery times available (consultation required) ◎ Supports rigid and FPC substrates as well

  • Printed Circuit Board
  • Processing Contract
  • others
  • etching

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[Must-See for Engineers!!] MEMS-related Photo Etching Technical Documentation Collection

[Must-See for Engineers!!] MEMS-related Photo Etching Technical Documentation Collection

A collection of technical materials that consolidates useful information for research and development related to MEMS, where technological development is advancing, is available for free!

MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to announce the comprehensive release of a "Technical Data Collection" that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as "photoetching," which is a fundamental technology in MEMS and display device substrates; "dicing processing," a technique for accurately cutting out circuits formed on silicon wafers into chips; and "bump formation," which is indispensable for various mounting technologies such as CSP, BGA, and flip chips. For more details, please contact us or refer to the catalog.

  • Processing Contract
  • Wafer processing/polishing equipment
  • etching

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Photo etching

Photo etching

We accept small-scale prototypes using precision photographic technology for fine processing.

We accept small-scale prototypes using photolithography and precision photography technology, which are essential technologies in MEMS and display devices. We form thin films on substrates such as glass substrates, silicon wafers, films, and ceramics, and create fine patterns through a consistent photolithography process. We can accommodate prototypes starting from a single piece. We also support prototypes for dicing and bump formation. Additionally, we can pattern dielectric films and multilayer films using lift-off processing. Substrate sizes can be customized as needed. Etching of silicon wafers and glass substrates is also possible. We can respond with short lead times (consultation required) and can accommodate rigid and FPC substrates. For more details, please contact us or refer to our catalog.

  • Processing Contract
  • etching

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