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glue(Food) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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[Research Report] Global Market for Adhesives for Food Packaging

World Market for Food Packaging Adhesives: Solvent-based Adhesives, Solvent-free Adhesives, Water-based Adhesives, Boiling Applications, General Applications

This research report (Global Food Packaging Adhesive Market) investigates and analyzes the current state and outlook for the global market for food packaging adhesives over the next five years. It includes information on the overview of the global food packaging adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include solvent-based adhesives, solvent-free adhesives, and water-based adhesives, while the segments by application focus on boiling and regular use. The regional segments calculate the market size for food packaging adhesives by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the food packaging adhesive sector, product and business overviews, and sales performance.

  • Other services

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Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag

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[Research Material] Global Market for Footwear Adhesives

Global Market for Footwear Adhesives: Solvent-based Footwear Adhesives, Water-based Footwear Adhesives, Radiation Cured (UV/EB) Footwear Adhesives, Hot Melt Footwear Adhesives, etc.

This research report (Global Footwear Adhesives Market) investigates and analyzes the current status and outlook for the global footwear adhesives market over the next five years. It includes information on the overview of the global footwear adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include solvent-based footwear adhesives, water-based footwear adhesives, radiation-cured (UV/EB) footwear adhesives, and hot melt footwear adhesives, while the segments by application focus on sports shoes, dress shoes, sandals, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size for footwear adhesives. It also includes the market share of major companies in footwear adhesives, product and business overviews, and sales performance.

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Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Other electronic parts
  • Other semiconductors
  • Other optical parts

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