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glue(string) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Heat Resistance Grade

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Pack-4.JPG
  • Other electronic parts
  • Other Auto Parts
  • Other motors

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

While maintaining the high reliability characteristic of epoxy resin, it achieves rubber-like elasticity and stretch.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Rectangular Connector
  • Rectangular Connector
  • Automotive Connectors

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag

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"Insulating" grade NIC BOND NB4000 Series

"Insulating" grade NIC BOND NB4000 Series

It is suitable for adhesion to areas requiring insulation. Non Conductive Type

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • H62シリンジ２.jpg
  • Other semiconductors
  • Other electronic parts
  • Other machine elements

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Characteristics: Low outgassing, low-temperature curing, oil-resistant, halogen-free. NIC BOND (part number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

  • NB1001(1).jpg
  • Other motors
  • Optical Connector
  • Other electronic parts

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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Other electronic parts
  • Other semiconductors
  • Other optical parts

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[Research Material] Global Market for Moisture-Curing Adhesives

[Research Material] Global Market for Moisture-Curing Adhesives

World Market for Moisture-Curing Adhesives: Polyurethane, Silicone, Cyanoacrylate, Polyolefin, Construction, Automotive, Wood, Textile, Others

This research report (Global Moisture Curing Adhesives Market) investigates and analyzes the current status and outlook for the global moisture curing adhesives market over the next five years. It includes information on the overview of the global moisture curing adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the moisture curing adhesives market focus on polyurethane, silicone, cyanoacrylate, and polyolefin, while the segments by application cover construction, automotive, wood, textiles, and others. The regional segments calculate the market size for moisture curing adhesives in North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the moisture curing adhesives sector, product and business overviews, and sales performance.

  • Other services

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