【Product Example】Heat Sink Fin
Examples of ultra-small heat sink fins produced through precision and fine press processing.
This is an introduction to a case study of heat sink manufacturing primarily used in IC (integrated circuit) semiconductors. The heat sink is bonded to the lead frame, enhancing the heat dissipation performance of the package. The material of this heat sink is a Cu alloy, with a thickness of 1.0mm or more selected to improve heat dissipation characteristics. The processing precision of the punched parts is ±0.03mm, which is highly accurate. 【Case Study】 ■Product Category: Heat Sink ■Industry: Semiconductor Industry ■Processing Category: Press, Punching, Forming ■Precision: ±0.03mm (punched parts) ■Material: Cu Alloy *For more details, please refer to the PDF document or feel free to contact us.
- Company:姫路東芝電子部品
- Price:Other