We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for inspection.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

inspection(lead) - List of Manufacturers, Suppliers, Companies and Products

inspection Product List

1~2 item / All 2 items

Displayed results

X-ray examination

Achieving non-destructive testing for BGA and CSP! As part of our pursuit of high quality, we have established detailed inspection standards.

To maintain the quality of products that cannot be visually inspected after reflow, we conduct checks using 'X-ray inspection.' In pursuit of high quality, we have established detailed inspection standards. These are critical items that determine the quality of the products. We perform inspections on all components that cannot be visually inspected, such as BGA, QFN, SON, DFN, LGA, and connectors. 【Features】 ■ Achieves high resolution and high density analysis capabilities with the X-ray TV inspection device (Softex WORK-LEADER 90). ■ Detailed inspection standards are set in pursuit of high quality. ■ Critical items that determine the quality of the products. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

X-ray imaging contract service for non-destructive testing of solder joint conditions, etc.

We also accept X-ray imaging of equipment and embedded boards designed and manufactured by our company, as well as boards implemented by other companies. Please feel free to consult with us.

We will take images of areas that are difficult to observe through visual inspection, such as the solder joint condition of leadless components mounted on the substrate and cable disconnections, using the X-ray inspection equipment we possess, and provide you with the image data. Please use this for quality control of products and identification of defective areas. 【Examples】 ■ Confirmation of solder joint condition of BGA mounted on the substrate ■ Detection of defects in solder joints (unconnected, bridging, voids, etc.) ■ Pattern inspection and defect detection of printed circuit boards ■ Detection of disconnections in flexible substrates ■ Detection of disconnections in cables and harnesses ■ Observation of internal structures and defects of products and electronic components ■ Detection of foreign matter contamination inside products *For more details, please download the PDF or feel free to contact us.

  • Xray_sub01_560.jpg
  • Xray_sub02_560.jpg
  • Xray_sub03_560.jpg
  • Xray_sub04_560.jpg
  • Xray_sub05_560.jpg
  • Xray_sub06_560.jpg
  • Xray_sub07_560.jpg
  • Xray_sub08_560.jpg
  • Xray_sub09_560.jpg
  • Contract manufacturing
  • Communications
  • Other network tools

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration