Clearly visualize the joint condition inside the printed circuit board. BGA inspection and X-ray inspection.
Achieving non-destructive testing for BGA and CSP! As part of our pursuit of high quality, we have established detailed inspection standards.
To maintain the quality of products that cannot be visually inspected after reflow, we conduct checks using 'X-ray inspection.' In pursuit of high quality, we set detailed inspection standards. This is a critical factor that determines the quality of the products. We perform inspections on all non-visible components such as BGA, QFN, SON, DFN, LGA, and connectors. 【Features】 ■ Achieves high resolution and high density analysis capabilities with the X-ray TV inspection device (Softex WORK-LEADER 90). ■ Sets detailed inspection standards in pursuit of high quality. ■ A critical factor that determines the quality of the products. *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケイ・オール
- Price：Other
