Processed material: compound semiconductor wafer
Polishing processing of various compound semiconductor crystals such as SiC, GaN, and GaP is possible!
At Japan Exceed, we perform polishing processing of various compound semiconductor crystals such as SiC, GaN, and GaP. We can also finish patterned compound wafers to a thin specification and accommodate delivery methods to our customers. Our company responds to polishing needs for various processing materials. 【Features】 ■ Polishing processing of various compound semiconductor crystals is possible ■ Can accommodate delivery methods to customers ■ Thickness: from 20μm ■ Surface roughness performance value GaP surface roughness: 0.1nm *For more details, please refer to the PDF document or feel free to contact us.
- 企業：日本エクシード
- 価格：Other
![[Information] Introduction of Processed Materials & Technologies](https://image.mono.ipros.com/public/product/image/2af/2000469406/IPROS10559356147134766220.jpeg?w=280&h=280)
