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simulation×Wave Technology - メーカー・企業と製品の一覧

simulationの製品一覧

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Stress analysis case studies: temperature cycle, vibration, drop impact simulation.

Stress analysis case studies: temperature cycle, vibration, drop impact simulation.

We will not only provide temporary measures for the products with issues but also assist in reducing the development loss costs for the next development products!

In the "Temperature Cycle Simulation," we conduct simulations considering the package structure to predict lifespan and propose improvements aimed at optimizing reliability. In the "Vibration Simulation," we analyze factors based on the product's mounting conditions (such as deformation of the housing during screw fastening) and provide proposals for countermeasures. In the "Drop and Impact Simulation," we perform factor analysis based on stress distribution using simulation techniques that consider the package structure and propose countermeasures. With our proven track record of collaboration with semiconductor vendors, we have a deep understanding of package structures, which we leverage to ensure consistency between simulations and actual measurements. We offer proposals for optimizing reliability based on the extensive knowledge of our specialized engineers in simulation, implementation, evaluation, and housing design. For more details, please download the catalog or contact us.

  • Contract Analysis
  • Other analyses

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Thermal simulation, thermal analysis (heat sink, thermal measurement)

Thermal simulation, thermal analysis (heat sink, thermal measurement)

Patent No. 5232289! Holds technology that accurately reflects the thermal characteristics of semiconductor components. Thermal simulation, thermal analysis (heat sinks, thermal measurements).

Are you facing thermal issues in product development? We can help solve that problem. Thermal simulation and thermal analysis (heat sinks, thermal measurements). When conducting simulations, expertise is required for modeling semiconductor components. WTI possesses technology that accurately reflects the thermal characteristics of semiconductor components, which are the heat sources, allowing for simulations that are close to actual measurements. [Features] ■ High-precision reflection of the thermal characteristics of semiconductor components, which are the heat sources ■ Simulations that are close to actual measurements ■ Patent No. 5232289 *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Circuit Board Inspection Equipment
  • Other semiconductors

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Stress simulation service (analysis) vibration, impact, drop, durability

Stress simulation service (analysis) vibration, impact, drop, durability

Are you struggling to respond to issues with the temperature cycle testing of your products? (Analysis) Vibration, shock, drop, durability.

The "Stress Simulation Service" uses a model that takes package structure into account to improve lifespan in temperature cycle testing. (Analysis) Vibration, impact, drop, durability In temperature cycle simulation, lifespan predictions are made through simulations that consider package structure, and improvement proposals aimed at reliability are suggested. Additionally, in vibration simulation, issues caused by vibrations during transport and operation are resolved, while drop and impact simulations address problems related to drop impacts on semiconductor component connections. 【Features】 ■ Improvement of lifespan in temperature cycle testing using a model that considers package structure ■ Reduction of loss costs in the range of millions of yen caused by additional prototypes and evaluations ■ Resolution of issues caused by vibrations during transport and operation (actual usage conditions) ■ Resolution of issues related to drop impacts on semiconductor component connections (solder) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Impact Test
  • Vibration Testing

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Simple Diagnosis of 'Heat Issues' That Can Be Done for 100,000 Yen (Simulation, Analysis)

Simple Diagnosis of 'Heat Issues' That Can Be Done for 100,000 Yen (Simulation, Analysis)

Temperature issues in product development require proactive heat dissipation design! Avoid costly heat dissipation measures and significant design revisions (simulation, analysis).

The "Thermal Issue" Simple Diagnosis Service is a service that diagnoses thermal problems in the early stages of product development (simulation, analysis). It predicts product temperature from the concept stage. We report the presence or absence of thermal issues along with one-point advice. Feedback on the validity of product size and heat dissipation policy (whether a fan is needed) is provided in the early design phase. This helps avoid costly heat dissipation measures and significant design revisions. 【Features】 ■ Predicts product temperature from the concept stage ■ Reports the presence or absence of thermal issues along with one-point advice ■ Provides feedback on the validity of product size and heat dissipation policy (whether a fan is needed) in the early design phase ■ Helps avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract Analysis
  • Other contract services

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Ensuring Reliability in Structural Design: Design Value Calculation Service (Design Margin Verification)

Ensuring Reliability in Structural Design: Design Value Calculation Service (Design Margin Verification)

We will solve your concern of 'It's unsettling to make judgments based only on experience... I want numerical evidence for the design rationale!' (Design margin confirmation)

We conduct "simulation for calculating design values" at our company. (Design margin confirmation) For example, if you want to create a waterproof design that can withstand water pressure, we analyze the relationship between the water pressure on the waterproof membrane and the load from the cushion using stress simulation to derive the appropriate cushion load. Additionally, if you are concerned about vibrations during the transportation and operation of the enclosure, we analyze the main factors causing the frame to resonate at dangerous frequency ranges and propose structural changes to shift the maximum resonance point to a safe frequency range. We have various case studies available. Please feel free to consult us. 【Simulation Use Cases】 ■ Waterproofing - Want to create a waterproof design that can withstand water pressure ■ Vibration - Concerned about vibrations during the transportation and operation of the enclosure ■ Implementation Reliability - Want to demonstrate the improvement effect on the reliability of BGA package joints *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • Contract Analysis

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[Data] Shirutoku Report No. 93 # Heat Simulation Cannot Be Done Easily

[Data] Shirutoku Report No. 93 # Heat Simulation Cannot Be Done Easily

Important tools! Here are the two major challenges in thermal simulation.

★★Shirutoku Report: Useful Information You Should Know★★ The Structural Design Department is broadly divided into simulation (thermal, stress) and mechanism design, and I am in charge of thermal simulation. I started with almost no knowledge of heat. Through daily learning, the simulation that visualizes the invisible "heat" is an important tool for solving and preventing various thermal issues, and I am currently learning its fundamentals. There are two major challenges in thermal simulation. Let me explain the reasons. [Contents] ■ Two Challenges in Thermal Simulation ■ Temperature Distribution Diagram Around Heat Sources (Simulation Results) *For more details, please refer to the PDF document or feel free to contact us.

  • simulator

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Case Study: Thermal Analysis (Thermal Simulation)

Case Study: Thermal Analysis (Thermal Simulation)

Reduce product costs with high-precision thermal property analysis! (Thermal simulation)

Are you increasing product costs to ensure product design reliability? If optimal thermal measures are not taken, excessive measures will reduce market competitiveness, while insufficient measures will increase development costs. However, by optimizing temperature margin design, total costs can be reduced (thermal simulation). Our unique method features localized heating of specific parts of the chip, with measurements taken at the PN junction (specific) within the heated area. Additionally, by constructing a simulation model that fits the measurement results, the entire system product can be temperature-predicted using simulation technology. We also offer consulting services, including the creation of libraries and the establishment of rules for heat dissipation measures and thermal management. For more details, please download the catalog or contact us.

  • Contract Analysis
  • Other analyses

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