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With the technology cultivated over many years, we will meet our customers' needs.
Since starting the prototype of single-sided printed circuit boards in 1972, we have been dedicated to manufacturing printed wiring up to the present day. We are also involved in the design of printed wiring patterns and the production of nameplates.
From circuit board design to component mounting and assembly, we can propose and provide products tailored to customer needs.
Arrow Industry creates products that meet customer needs, thanks to its in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to handle everything from PCB design and manufacturing to component assembly. 【Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Support from PCB design and manufacturing to component assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Aluminum Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component mounting and assembly.
The "Thick Copper Multi-layer Circuit Board" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.
Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Base Single-Sided Board" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs, thanks to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services ranging from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "LED-COB module" is a product handled by Arrow Industries Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
It is possible to efficiently release the heat from the heating components to the outside! Double-sided through-hole metal substrate.
The "Double-Sided Through-Hole Metal Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. The substrate is machined to expose the metal core, allowing heat dissipation components such as heat sinks to be directly mounted or connected to the housing, efficiently releasing heat from heat-generating components to the outside. If it has a copper core, the connection between the copper core and the through-hole can enhance heat dissipation. 【Features】 ■ Efficiently releases heat from heat-generating components to the outside ■ If it has a copper core, the connection between the copper core and the through-hole can enhance heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.
For heat dissipation solutions, come to us! We provide comprehensive support from circuit board design to logistics.
Arrow Industries manufactures and sells industrial equipment, semiconductor bare chip mounting substrates, and consumer substrates. In particular, for LED mounting substrates, we are highly regarded for our thermal management metal substrates using high thermal conductivity sheets, as well as structural substrates designed with various heat dissipation pathways. Additionally, we provide a comprehensive service from substrate design and manufacturing to component procurement, component mounting, quality assurance, and logistics. Our company is a solution-oriented enterprise that embodies high quality through a multifaceted perspective on inefficient products. 【Features】 ■ Structural substrates designed with various heat dissipation pathways ■ Comprehensive service from substrate design and manufacturing to component procurement, component mounting, quality assurance, and logistics ■ Embodying high quality through a multifaceted perspective on inefficient products ■ Proposing and providing products tailored to customer needs from substrate design to component mounting and assembly *For more details, please refer to the PDF materials or feel free to contact us.
Countermeasures against component degradation caused by UV LEDs! A UV-resistant special substrate made by combining a copper base substrate and a glass epoxy substrate.
The "hybrid substrate" developed by our company refers to a composite substrate that combines "copper-based substrate" and "glass epoxy substrate," designed to prevent degradation of connectors and components due to ultraviolet (UV) light, which is a problem with substrates equipped with UV LEDs. It features a special shape where the glass epoxy substrate is embedded in the copper-based substrate. By placing the connector on the backside of the UV LED, it protects against degradation from UV light. By partially forming through-holes, it allows for component mounting, such as connectors, on the backside while being a metal-based substrate, thus preventing degradation of components from UV light. ○ Features - Prevention of component degradation from UV light - High heat dissipation - Relaxation of constraints on component placement - Metal base ○ Applications - Exposure UV-LED modules - Lighting UV-LED modules etc.
Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.
<Heat Dissipation Measures with Special Substrates> - Metal (Copper/Aluminum) Bump Substrate A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently. - Water-Cooled Flow Path Circuit Substrate A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management. <UV Protection Substrates for UV-LEDs> - Hybrid Substrate A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light. - Inorganic Resist Coated Substrate An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.
Heat dissipation performance and durability are fused! UV high-reflective resist enables long lifespan for mounted components and substrates.
The developed UV high-reflective resist substrate features a metal substrate (copper or aluminum) with high heat dissipation properties, which is used as a heat dissipation substrate. By applying a self-developed inorganic resist ink, it prevents the degradation of the resist on the substrate. Furthermore, this resist ink has successfully achieved over 80% reflection of ultraviolet light (UV-A, UV-B, UV-C). In the case of standard white resist, prolonged exposure to UV light causes the resist applied on the substrate to yellow and degrade. By using our self-developed UV high-reflective resist, we can prevent substrate degradation and efficiently reflect UV-LED light. 【Features】 ■ Self-developed product ■ Maintains high reflectivity even in the UV-C range ■ Requires long-term reliability *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "High Heat Dissipation Flow Path Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Core Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.
We propose suitable heat dissipation measures for devices that carry large currents! Introducing a substrate compatible with large currents!
The "High Current Compatible Substrate" is a metal substrate designed to accommodate high-output devices by incorporating thick copper foil into the heat dissipation characteristics of a metal base substrate. We propose suitable heat dissipation measures for devices that carry high currents. 【Features】 ■ Incorporates thick copper foil into the heat dissipation characteristics of the metal base substrate ■ Proposes suitable heat dissipation measures for devices that carry high currents *For more details, please refer to the PDF document or feel free to contact us.
