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substrate×プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Achieving the perfect fit! Printed Circuit Board Product Information

Achieving the perfect fit! Printed Circuit Board Product Information

Please let us assist you with support for each process, from deadline management and specification adjustments to full process support.

【Features of Puriken】 ■ Product lineup: Supports various specifications from single-sided to high multilayer, through-hole, IVH, and build-up ■ Full support system: Comprehensive support from circuit board design to manufacturing and component assembly (coordinating optimal lead times) ■ Process tracking: Real-time tracking of circuit board manufacturing process progress (providing a convenient system to understand process progress) ■ Educational support: WEB factory tours via LIVE video (showing all circuit board manufacturing process equipment), also accommodating on-site seminars ◇ Examples of actual products Product applications: Power supply, measurement, motors, video, communication, audio, sensors, and others High-speed signal and high-frequency circuits: 4K/8K video equipment, medical cameras, wireless devices, various antennas High current and high voltage: UPS uninterruptible power supplies, battery packs, various in-vehicle ECUs, lighting equipment < Circuit Board Design > Supported CAD / In-house owned: CR-5000BD, CR-8000DF Design specifications: Digital, analog, mixed digital-analog, high-speed transmission, high current, high voltage, etc. < Circuit Board Manufacturing > Number of layers: Single-sided to 24 layers, fixture boards Specifications: Through-hole, pad-on-via, IVH, build-up, etc. * Many other product examples are available! For more details, please download the materials or contact us.

  • Circuit board design and manufacturing
  • Inspection fixture

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Easily grasp the progress of substrate manufacturing! Substrate process tracking service "Progress-kun"

Easily grasp the progress of substrate manufacturing! Substrate process tracking service "Progress-kun"

[Presentation Materials Available] A detailed document condensed with the latest technology and abundant achievements thoroughly explains the true value and effectiveness of Shinchoku-kun. Please experience the business transformation!

"Progress-kun" is a cloud-based system provided by Priken that enables visualization of the circuit board manufacturing process. Upon placing an order, an automatic confirmation email is sent to the representative, along with an ID, password, and access URL, allowing real-time tracking of the progress. The monthly order volume ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be completed on the same day the order is placed. This is made possible by a one-stop system that allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. □ As a comprehensive contact point for PCB companies! Everything and anything! ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please download the PDF or feel free to contact us.

  • Process Control System

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Announcement of a Free Webinar on Printed Circuit Boards

Announcement of a Free Webinar on Printed Circuit Boards

Announcement of Webinar / September 9 (Tuesday) 11:00 AM - 12:00 PM 【A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!!】

A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!! In cases where there are components or circuit configurations that may generate heat, and new or unknown factors necessitate heat countermeasures, delays or failures in design responses can occur due to a lack of experience in thermal design or the absence of analysis tools. This can lead to problems in actual devices and delays in development schedules. To conduct thermal analysis, tools are typically required, but many do not have the necessary resources, and hiring specialized firms can often be costly. In this webinar, we will introduce heat countermeasure techniques that can be implemented even when there is no time or budget for simulations. ■ Recommended for: - Engineers dealing with components or circuits where heat generation is a concern, such as power circuits, motor control, and LED boards. - AW designers ■ Date: Tuesday, September 9, 2025, 11:00 AM - 12:00 PM ■ Format: Webinar (using Zoom) ■ Organized by: Ryosan Corporation ■ Co-organized by: Priken Corporation ■ Participation Fee: Free *For more details, please refer to the related link URL below or feel free to contact us.

  • Printed Circuit Board

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

  • Circuit board design and manufacturing

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PuriKen Co., Ltd. Free Webinar on Printed Circuit Boards

PuriKen Co., Ltd. Free Webinar on Printed Circuit Boards

Is it still getting smaller? Trends in power electronics technology visible from the disassembly of the power control unit of the new Prius - Miniaturization technology 'busbar' and more.

We will hold a free webinar titled "Is it still getting smaller? Trends in power electronics technology revealed through the disassembly of the new Prius power control unit." In this webinar, we will provide insights into the challenges faced by power electronics engineers and potential solutions. Additionally, we will discuss trends in power electronics miniaturization technology, the effectiveness of front-loading development methods, and how Scideam reduces simulation time (developed by the Smart Energy Research Institute). We will also introduce the combination of printed circuit boards and busbars as a miniaturization technology for high-voltage and high-current printed circuit boards. [Webinar Overview] ■ Date and Time - Day 1: July 16 (Tuesday) 11:00-12:00 - Day 2: July 23 (Tuesday) 11:00-12:00 ■ Organized by - Ryosan Co., Ltd. *For more details, please refer to the related link URL below or feel free to contact us.

  • Printed Circuit Board

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PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

PuriKen Co., Ltd. - A substrate that dissipates heat faster from printed circuit boards.

A suitable design! We propose a substrate that dissipates the heat from the heating element more quickly.

We would like to introduce our "substrate that dissipates heat faster." With the emergence of high-output power semiconductors, new implementation methods and thermal management strategies are required. From the perspective of printed circuit board manufacturing, we propose a substrate structure that can dissipate heat more quickly. Additionally, we customize the substrate to optimize the arrangement and shape of thermal vias according to usage, allowing for greater heat dissipation. 【Features】 ■ Simple thermal calculations conducted from the perspective of substrate manufacturing ■ Suitable designs presented based on calculation results ■ Proposals for substrate structure and heat dissipation strategies by our technical department *For more details, please download the PDF or feel free to contact us.

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  • Printed Circuit Board

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Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

We are currently offering materials that explain the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling materials inside TH.

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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