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substrate×太洋テクノレックス 本社 和歌山 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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【TTL_展示会レポート】JPCAShow2024出展内容

『FPCのお困り事、一刀両断!』太洋テクノレックスは次代のニーズを敏感にキャッチし、フレキシブルな技術力でFPCを牽引!

フレキシブルプリント配線板 高周波フッ素複合材3層FPC  誘電特性に優れたフッ素複合材FPCでノイズ対策と狭小化を両立。同軸ケーブルからの転換にも好適。 MSAP工法~超細線FPC~  めっきアップで高精度、かつ高密度の微細配線を実現。配線断面の矩形性に優れ、イメージ通りの配線形成が可能。 透明FPC  優れた光透過性と耐熱性を備えチップ実装も可能なFPC。  製品のデザインを損なうことなく配線の引き回しが可能。 6層スタックビアFPC  ビアフィリング技術によるスタックビア構造で、さらなる高密度配線化を実現。配線スペースの有効活用により、設計自由度の向上に貢献。 基板検査システム【最終外観検査】  パッケージ・モジュール系基板に好適な光学分解能2.5µm仕様機が遂にラインナップ!   虚報低減AIシステム『ザイス』と欠陥検出AIシステムの採用で最終外観検査工程の効率化を大幅にアップしました。 マテハン・協働ロボット活用で自動化・効率化を提案 協働ロボット・産業用ロボットのシステムインテグレートや周辺機器など、お客様の業種や業態に適したFAシステムをご提案致します。

  • Printed Circuit Board

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Experience Taiyo Technorex's FPC at Nepcon Japan 2025!

Fureki's social study trip, experience Taiyo Technorex's FPC at Nepcon Japan 2025!

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area through high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We also have live demonstrations of 'FA Automation' and 'Latest Appearance Inspection Systems using AI Technology'! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate calibration burdens and realize high-precision, high-speed operation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, AI system 'TY-VISION XAIS,' has entered Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect by inspection devices, even though they can be identified visually.

  • Printed Circuit Board

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