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substrate Product List

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[Data] Shirutoku Report No. 15 #Substrates and Applications

Explanation of the types and uses of substrates! In particular, we will introduce the types of rigid substrates.

★★Shirutoku Report: Useful Information You Can Benefit From★★ The design values and finished values for wiring widths and layer spacing differ depending on the type of circuit board and manufacturing methods (such as subtractive methods, semi-additive methods, etc.). In this report, we will introduce the different types of circuit boards available. Additionally, WTI offers various types of circuit board design and prototyping services. Please feel free to reach out to us. 【Contents】 ■ Types of Circuit Boards and Their Applications *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Prototype Services
  • Printed Circuit Board

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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*

  • Contract Analysis
  • Contract Analysis
  • Other analyses

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[Information] Shirutoku Report No. 75 # Technical Standards Compliance Certification (Giteki) Application

What should I prepare for the application for technical standards conformity certification? Information on necessary documents for the application is provided.

★★Shirutoku Report: Useful Information You Should Know★★ In this document, we would like to provide detailed information about "Technical Compliance" (Giteki), which has seen an increase in inquiries. We will explain what is required for a Giteki application using the example of a Bluetooth (BLE) module application. We also include the benefits of requesting a Giteki application from a design company, so please take a moment to read through it. 【Contents】 ■ What is required for a Giteki application... ■ What are the benefits of requesting a Giteki application from a design company? *For more details, please refer to the PDF document or feel free to contact us.*

  • others

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[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

What criteria should be used for selecting components? Introducing the selection criteria for LNA!

★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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