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substrate×プリント電子研究所 - メーカー・企業と製品の一覧

substrateの製品一覧

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Printed Circuit Board "Super Large Rigid Board"

Printed Circuit Board "Super Large Rigid Board"

Also capable of producing ultra-large multilayer PCBs! PCB production possible up to 1000×1200mm.

Leave the large substrates to us! We can process up to jumbo sizes of 1000×1200. Contact us now for inquiries and consultations!! 【Specifications】 ○ Board thickness – Single-sided/Dual-sided: 0.1mm to 3.2mm – 3 layers to 6 layers: 0.8mm to 3.2mm – 7 layers and above: 1.2mm to 3.2mm ○ L/S (Line & Space) – 0.15/0.15mm or more ○ Hole diameter – φ0.3mm or more For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Space-saving can be achieved! A multilayer flexible substrate that can reduce manufacturing costs.

Multilayer flexible circuit boards help save space! When wiring in tight spaces, it can become densely packed. By using multilayer flexible circuit boards, it is possible to arrange components while maintaining a certain degree of flexibility and thinness. We are available for consultation even from the decision-making stage, so please feel free to contact us★ 【Features】 ○ Reduction in soldering points ○ Elimination of wiring errors ○ Improved reliability ○ Labor-saving in processing and assembly ○ Reduction in manufacturing costs For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Printed circuit board "Microfabrication printed circuit board"

Printed circuit board "Microfabrication printed circuit board"

Achieving narrow pitch and space-saving with precision processing substrates!

Print Electronics Research Institute Co., Ltd. responds to customer requests through microfabrication of flexible substrates, rigid substrates, and more. We are confident that we can manufacture products tailored to customer needs with our diverse lineup of materials. Please feel free to consult with us! 【Features】 ○ Production is possible with single-sided L/s (line & space) = 50/50μ and double-sided L/s = 60/60μ ○ Further miniaturization is possible due to high-density wiring For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Flexible printed circuit board (FPC). Bendable!

Flexible printed circuit board (FPC). Bendable!

Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.

The product is a flexible printed circuit board that can be bent. It is compact, thin, and lightweight, allowing for a reduction in connections with connectors that can be integrated into small spaces. It can be used in digital cameras, laptops, smartphones, printers, and other small devices. We provide a detailed introduction to the manufacturing process in the PDF document, so please download and take a look. 【Features】 ■ Flexible and bendable ■ Reduces connections with connectors that can be integrated into small spaces ■ Compact, thin, and lightweight *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Leave the manufacturing of long FPC to us! Standard: Capable of producing sizes up to 2000×500mm. *For lengths beyond that, please consult us (we have experience with lengths up to 20M).

Aiming to be "the leader in long-length printed electronics," we are dedicated to meeting our customers' needs every day. Are you facing challenges such as considering long substrates but finding it difficult to find a suitable provider, or struggling with high labor costs and low-volume production? With over half a century of experience and more than 10,000 types of manufacturing achievements, we are here to assist you with our proposal capabilities for specialized products. 【Specifications】 ○ Board thickness: Single-sided and double-sided 0.0125mm, 0.025mm, 0.05mm ○ L/S (Line & Space): 0.15/0.15mm or more ○ Hole diameter: φ0.3mm or more For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Contract manufacturing
  • Processing Contract

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Printed circuit board "flex-rigid board"

Printed circuit board "flex-rigid board"

Achieving connectorless implementation, flex-rigid substrate.

Flexible rigid substrates have a complex structure, involve many processes, and take a considerable amount of time to produce. Therefore, it can be challenging to commit to production for small quantities. We can help solve such concerns. Please feel free to consult with us. 【Features】 - A substrate that combines rigid and flexible materials - Utilizes the advantages of both flexible and rigid substrates - Connector-less mounting is possible - Space-saving design for the substrate - Smoothness and flatness can be produced almost the same as standard rigid substrates - Allows for higher density wiring and mounting compared to single-sided substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.

We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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