1～11 item / All 11 items
64-Channel Latching or Momentary Relay Board with Built-in-Test
The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.
32-bit Optically Isolated Digital Output
Optically Coupled Digital Output board consists of VMEbus compatibility logic,data control logic, four 8-bit output registers, and 32 optically isolated high-level outputs. The board is implemented as a double Eurocard form factor PC board, and provides all necessary address decoding and data transfer control logic to accept both 8- and 16-bit data transfers. Optical couplers isolate the 32 outputs from each other and from the VMEbus. Both supervisory and nonprivileged data transfers are supported.
You will be able to use PoE devices such as network cameras in a solar/battery environment.
Texas Instruments Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PSE (Power Sourcing Equipment) for PoE (Power over Ethernet).
![[Research Material] Global Market for Semi-Insulating SiC Substrates](https://image.mono.ipros.com/public/product/image/db3/2001463731/IPROS32029003209614041608.jpeg?w=280&h=280)
World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...
This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.
![[Research Material] Global Market for Semiconductor and IC Packaging Materials](https://image.mono.ipros.com/public/product/image/4ad/2001459780/IPROS55742427352240527127.jpeg?w=280&h=280)
Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Solder Balls ...
This research report (Global Semiconductor and IC Packaging Materials Market) investigates and analyzes the current state and future outlook of the global market for semiconductor and IC packaging materials over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, ceramic packages, solder balls, and others, while the segments by application cover the electronics industry, medical, automotive, telecommunications, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for semiconductor and IC packaging materials. The report also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.
![[Research Material] Global Market for Semiconductor and IC Packaging Materials](https://image.mono.ipros.com/public/product/image/bf3/2001473117/IPROS31708585334571296426.jpeg?w=280&h=280)
Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Automotive Industry ...
This research report (Global Semiconductor & IC Packaging Materials Mark) investigates and analyzes the current state and future outlook of the global semiconductor and IC packaging materials market over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, and ceramic packages, while the segments by application cover the automotive industry, electronics industry, telecommunications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor and IC packaging materials. It also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.
![[Research Material] World Market for Single-Sided FPC Coverlays](https://image.mono.ipros.com/public/product/image/1ad/2001480657/IPROS51305695250190874528.jpeg?w=280&h=280)
Global Market for Single-Sided FPC Coverlays: Yellow Coverlays, Black Coverlays, Consumer Mobile Devices, Medical, Industrial, Avionics...
This research report (Global Single Sided FPC Coverlay Market) investigates and analyzes the current state and outlook for the global single-sided FPC coverlay market over the next five years. It includes information on the overview of the global single-sided FPC coverlay market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided FPC coverlay market include yellow coverlay, black coverlay, and others, while the segments by application cover consumer mobile devices, medical, industrial, avionics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of single-sided FPC coverlay. It also includes the market share of major companies in the single-sided FPC coverlay market, product and business overviews, and sales performance.
![[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates](https://image.mono.ipros.com/public/product/image/07b/2001468226/IPROS36719060859120934293.jpeg?w=280&h=280)
World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...
This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.
![[Research Material] World Market for Single-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/adf/2001481416/IPROS43792779215493735878.jpeg?w=280&h=280)
World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others
This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.
