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substrate(art) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Jun 03, 2026～Jun 30, 2026
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substrate Product List

31～42 item / All 42 items

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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X-ray Component Counter "Assure Series"

X-ray Component Counter "Assure Series"

Instant measurement of reel internal parts! Compatible with trays, sticks, and cut products.

The "Assure Series" is an X-ray component counter that accurately counts the number of internal parts in a reel with "Smart," "Simple," and "Speedy" features. It can measure while still in the packaging, allowing for counting even in ESD bags or with desiccants. Additionally, as a feature exclusive to the Pro model, it can be managed even more efficiently with the built-in barcode camera. 【Features】 ■ One of the smallest installation footprints in the industry ■ Fast and easy counting ■ Measurement can be done while still in packaging ■ Component absence detection function ■ Pro model exclusive features *For more details, please refer to the related links or feel free to contact us.

  • X-ray inspection equipment
  • substrate

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing
  • substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • substrate

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing
  • substrate

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Apollo Seiko Co., Ltd. Soldering Equipment Comprehensive Catalog

Apollo Seiko Co., Ltd. Soldering Equipment Comprehensive Catalog

Comprehensive catalog of soldering equipment. Featuring devices characterized by high quality, high efficiency, and ease of use.

The "Soldering Equipment Comprehensive Catalog" from Apollo Seiko Co., Ltd., handled by Keitecno Co., Ltd., features the next-generation robot "L-CAT NEO," which is equipped with all the necessary functions for soldering, as well as various high-quality, high-efficiency, and user-friendly soldering robots and equipment. The soldering equipment from Apollo Seiko Co., Ltd. includes features such as "solder tip exchange," "solder ball scattering prevention mechanism," and "accumulated technological expertise." [Contents] - Automatic soldering robots - Soldering units - Manual soldering equipment - Soldering-related devices - Soldering options and consumables For more details, please contact us or download the catalog.

  • Soldering Equipment
  • Other industrial robots
  • substrate

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Electronic Component Reel Management - Parts Management System 'MYTower'

Electronic Component Reel Management - Parts Management System 'MYTower'

Manage, ship, and replace electronic component reels quickly and easily! Due to its compact design, it can be placed near the electronic circuit board assembly line! Case study materials are also available.

The electronic component reel management system "MYTower" is a component management system that plays a vital role in the pre-process of circuit board assembly (SMT). It allows for systematic management and shipping of multiple electronic component reels, making replacements easy. Additionally, its compact design enables it to be installed close to the circuit board assembly line, saving space. In particular, there are numerous achievements with EMS providers who frequently replace electronic component reels or perform multi-variety circuit board assembly. It can also flexibly respond to replenishment needs during stock shortages. Case study materials are also available. **Features** - No mix-ups with various electronic component reels (increased productivity) - Automatically tracks all stored reels and component quantities - Ensures that the correct components are always shipped and received - Compact design allows for placement near the circuit board assembly line (increased efficiency) - Can store up to 740 reels in a floor area of 1 square meter - Easy one-reel shipping for replenishment using a handheld scanner - A dual terminal option is available, considering the movement lines of people and materials *For more details, please refer to the PDF materials or feel free to contact us.*

  • Production Management System
  • substrate

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5G base station antenna compatible printed circuit board (PCB)

5G base station antenna compatible printed circuit board (PCB)

We would like to propose a printed circuit board for 5G base station antennas!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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400Gbps switch-compatible printed circuit board (PCB)

400Gbps switch-compatible printed circuit board (PCB)

We would like to propose a printed circuit board compatible with 400Gbps switches!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Research Material] Global Market for Semi-Insulating SiC Substrates

[Research Material] Global Market for Semi-Insulating SiC Substrates

World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...

This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.

  • Other services
  • substrate

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[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates

[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates

World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...

This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.

  • Other services
  • substrate

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