Understand it completely in 5 minutes! A textbook on semiconductor PKG trim and forming molds.
All 8 pages! A clear diagram of the main 5 processes of trim forming molds!
"Trim forming molds" refer to molds used for cutting and bending the lead parts and unnecessary resin after the semiconductor package molding. There are various types of trim forming molds (T/F molds) designed for different processes, each serving a specific role. This document provides a clear explanation of each process with illustrations. We encourage you to read it! [Contents] ■ What are trim forming molds? ■ Pre-cutting - Gate cut - Tie bar cut - Support cut ■ Post-cutting - Lead cut - Lead forming ■ Summary ■ Introduction of related products and services ■ Company overview *For more details, please refer to the PDF document or feel free to contact us.
- Company：ローム・メカテック
- Price：Other
