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Barrel polishing machine Product List and Ranking from 34 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Barrel polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. チップトン Aichi//Manufacturing and processing contract
  2. Kovax Corporation Tokyo//Other manufacturing
  3. 河新 洗浄機・洗浄剤│バレル研磨機材│ブラスト機材│研磨材 販売及び受託加工 Osaka//Industrial Machinery
  4. 4 新東工業 Aichi//Industrial Machinery
  5. 5 サンシン Niigata//Manufacturing and processing contract

Barrel polishing machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  2. Barrel Polishing Abrasives and Compounds Comprehensive Catalog チップトン
  3. Variable Capacity Pot Centrifugal Barrel Polisher from Small to Large Volume 新東工業
  4. 4 Rotary Barrel Polishing Machine 河新 洗浄機・洗浄剤│バレル研磨機材│ブラスト機材│研磨材 販売及び受託加工
  5. 5 Taylor Vortex Flow チップトン

Barrel polishing machine Product List

16~30 item / All 113 items

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Glossy Liquid Compound 'LC-506'

Suppress corrosion on copper and copper alloys! Achieve a stable glossy finish by reducing discoloration after polishing.

"LC-506" is a gloss liquid compound specifically for copper. It suppresses discoloration and corrosion on copper and copper alloys. It is not subject to the PRTR Law, and does not contain substances regulated by the ELV Directive, RoHS Directive, or boron. Additionally, in the case of conventional products (for steel), if the workpiece is not removed immediately after polishing, a gloss reduction of over 20% occurs. However, this product maintains gloss reduction within 5%. 【Features】 ■ Suppresses copper leaching ■ High rust prevention capability ■ Not subject to the PRTR Law ■ Does not contain substances regulated by the ELV Directive ■ Does not contain substances regulated by the RoHS Directive ■ Does not contain boron *For more details, please refer to the PDF materials or feel free to contact us.

  • Other abrasives

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Liquid compound "LC-613"

Double effect of high degreasing power and rust prevention! Liquid compound suitable for barrel polishing with a rough finish.

"LC-613" is a coarse finish liquid compound for barrel polishing. It has a dual effect of high degreasing power and rust prevention, preventing oil from dripping and rust from appearing. Additionally, it is not subject to the PRTR Law and does not contain substances regulated by the RoHS Directive, ELV Directive, boron, or nitrites. 【Features】 ■ Not subject to the PRTR Law ■ Does not contain substances regulated by the RoHS Directive ■ Does not contain substances regulated by the ELV Directive ■ Does not contain boron ■ Does not contain nitrites *For more details, please refer to the PDF materials or feel free to contact us.

  • Other abrasives

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Dry soft media for barrel polishing 'SMD'

The grinding marks disappear! Introducing a dry soft media suitable for hard workpieces.

"SMD" is a dry soft media for barrel polishing that achieves a surface roughness of Ra < 0.005 μm. It is suitable for grinding materials such as cutting tools, artificial bones, jewelry, bearings, and HDD components. With a glossiness of > 1,000, the sizes range from #5 to #60, and the product bulk density is 0.69 g/cm³. 【Features】 ■ Achieves surface roughness Ra < 0.005 μm ■ Diamond powder grinding material ■ Suitable for hard materials ■ New domain with glossiness > 1,000 *For more details, please refer to the PDF document or feel free to contact us.

  • Other abrasives

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Barrel polishing grinding stone "WXT-J"

The uniquely shaped tip fits securely into gaps! Consistent quality delivers stable polishing performance.

"WXT-J" is a star-shaped grinding stone suitable for micro cutting. The uniquely shaped tip fits securely into gaps, allowing for a clean R finish. Consistent quality ensures stable grinding performance. The star shape reduces in size while maintaining its form, effectively capturing gaps. 【Features】 ■ Improved shape retention performance ■ Enhanced inner diameter grinding performance ■ Capable of achieving a clean R finish ■ Consistent quality provides stable grinding performance *For more details, please refer to the PDF document or feel free to contact us.

  • Other abrasives
  • Other cutting tools

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Barrel Polishing Abrasives and Compounds Comprehensive Catalog

Manufactured in 1500 varieties according to grinding purposes! We have listed powder compounds and more.

This catalog introduces polishing stones and compounds for barrel polishing. Generally composed of abrasives and bonding agents, Chipton polishing stones are manufactured in 1,500 varieties tailored for different polishing purposes, including options like "ceramic media" and "plastic media." Additionally, we also feature Chipton compounds, which are additives designed to improve polishing efficiency. We encourage you to take a look. [Contents] ■ Polishing Stones ■ Compounds *For more details, please refer to the PDF document or feel free to contact us.

  • Other abrasives
  • Other cutting tools

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Coating device "FCVA Vacuum Deposition System"

Utilize various coating equipment that meets different film formation needs!

NanoFilm Technologies Japan Co., Ltd. can meet the diverse needs of our customers by utilizing various devices that match different film deposition requirements, using a variety of sources and complete systems. Our experienced research and development engineers study the requirements of diverse applications and determine the optimal processes based on that research. Additionally, we are fully committed to providing high-quality film deposition services by establishing in-house infrastructure for production, research and development, and quality control, maximizing customer satisfaction. 【Coating Systems】 ○ FS Series: FCVA Source ○ B Series: Batch System ○ L Series: Load/Lock System ○ M Series: Inline Coating System For more details, please contact us or download the catalog.

  • Surface treatment contract service

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OTEC / Stream Finish Machine SF-HP

The maximum load capacity is 200kg! This large machine was developed for barrel polishing of large and heavy workpieces.

The newly developed SF-HP series, designed for large and heavy workpieces, can handle overall surface finishing of products, including deburring, edge rounding, and improving surface roughness. It is particularly capable of processing a wide range of large workpieces in industries such as aerospace, energy, automotive, oil and gas, shipbuilding, and food.

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  • SF-HP特徴案再_画質変更-1024x843.png
  • Other machine tools
  • Wafer processing/polishing equipment

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Magnetic Barrel Polisher "MBF-700 Model"

Multiple magnetic plates are provided to rotate, and the magnetic plate axis also revolves! Processing can be done uniformly across the entire surface of the container.

The "MBF-700 model" is a magnetic barrel polishing machine used for polishing large parts made of metal or non-metal thin materials. Both the rotation speed of the self-rotation and revolution can be adjusted easily to match the workpiece. When the workpiece and media are placed in the container on top of the machine, they are violently turned due to the rotating magnetic field, resulting in a clean surface in a short time. Additionally, please feel free to consult us about special specifications (such as an exterior made of SUS). 【Features】 ■ Used for polishing large parts made of metal or non-metal thin materials ■ Effective diameter of 660mm ■ Uniform processing across the entire surface of the container ■ Can process three φ260mm processing containers simultaneously in addition to the included container ■ The magnetic plate moves up and down, making it easy to attach and detach the processing container *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

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Electromagnetic Barrel Polishing Machine 'EMB-190S/EMB-110'

When the work is placed inside, it rolls vigorously due to the electrically generated magnetic field! A beautiful surface can be obtained in a short time.

The "EMB-190S/EMB-110" is an electromagnetic barrel polishing machine used for polishing small metal or non-metal parts. In a powerful alternating magnetic field, the magnetic barrel media repeatedly delivers significant rolling energy, colliding violently with the workpiece, resulting in efficient surface finishing. It is particularly effective for finishing precious metal lost-wax castings. There are also examples of processing ceramics and plastics. 【Features】 - Used for polishing small metal or non-metal parts - Can achieve the same polishing effect regardless of the number of workpieces - Can obtain a gloss even on complex shapes - Can remove very small burrs - Suitable for somewhat bulky workpieces *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

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Coating device "TRA-350 type"

Improving traditional complaints! The new series has become easier to use.

The "TRA-350 model" is a smooth, non-stick rotary coating device. It features a welded, integrated structure for the pan section, with no internal irregularities such as bolts. It excels in strength and durability, and can accommodate all SUS specifications and changes in pan capacity. 【Features】 ■ Non-stick ■ Smooth ■ Welded, integrated structure for the pan section ■ No internal irregularities such as bolts ■ High strength and high durability *For more details, please refer to the catalog or feel free to contact us.

  • Other processing machines
  • Food Processing Equipment

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Coating device "Coaterrow CCM"

A specialized powder coating machine effective for fragile and easily chipped centers.

The "Coaterrow CCM" is a vibration-type powder coating device suitable for powder application. By vibrating the coating tank, a spiral flow is created in the center, allowing for uniform powder application simply by adding the powder. The vibration frequency and amplitude can be adjusted according to the properties of the center and the coating purpose, making it effective for centers that are prone to cracking and chipping. 【Features】 ■ Vibration frequency and amplitude can be adjusted according to the properties of the center and the coating purpose ■ Effective for centers that are prone to cracking and chipping ■ Supports labor-saving and automation ■ Resistant to chipping and cracking ■ Uniform coating on uneven surfaces *For more details, please refer to the catalog or feel free to contact us.

  • Other processing machines
  • Food Processing Equipment

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Camwrap device

A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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Full Surface Grinding (Z-axis Control)

A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment

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Barrel polishing machine [Capable of processing large and heavy items]

It is possible to process high-weight workpieces! The Yamashina tiltable barrel polishing machine enables efficient polishing.

The "Tank Direct Drive Barrel Polisher" has an extremely simple structure with few maintenance points. Barrel polishing involves placing workpieces (products), media (abrasive stones), compounds (abrasives), and water into a barrel tank and applying a constant rotational motion to stir them, allowing for mutual friction. This process can remove burrs and edges, eliminate scale, and achieve a glossy finish. Once the working conditions are set, it consistently produces uniform results without variation, making it suitable for finishing mass-produced items. 【Features】 ■ Capable of processing high-density workpieces ■ Extremely simple structure with few maintenance points ■ Speed control via inverter ■ Tank tilting can be operated with a button For more details, please refer to the catalog or feel free to contact us.

  • Other surface treatment equipment

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[Grinding Device] Tape Grinding Unit "BM Series"

Polishing equipment that maximizes the characteristics of polishing film.

The "BM Series" tape polishing unit is a polishing device that maximizes the characteristics of polishing films. Depending on the material of the workpiece, surface roughness management can be easily achieved by selecting the controller and polishing tape. 【Features】 ○ Lightweight and compact design ○ PLC control adopted ○ Capable of dry and wet polishing ○ Soft pressure and fixed-position polishing possible ○ Simplified tape replacement work For more details, please contact us or download the catalog.

  • Wafer processing/polishing equipment

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