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Built-in Modules Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Built-in Modules Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. アスメック Kanagawa//Optical Instruments
  2. ミカサ商事　MIKASA SHOJI CO., LTD. Osaka//Trading company/Wholesale
  3. HMSインダストリアルネットワークス Kanagawa//Industrial Machinery
  4. 4 ヒルシャー・ジャパン Tokyo//Industrial Electrical Equipment
  5. 5 ヘルヴェチア Okayama//Industrial Machinery
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Built-in Modules Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. MX5000B-XA | Embedded GPU Module アスメック
  2. BOXER AI Series BOXER-8652AI ミカサ商事　MIKASA SHOJI CO., LTD.
  3. COM Express Type 10　NANOCOM-MTU ミカサ商事　MIKASA SHOJI CO., LTD.
  4. 4 Embedded module Anybus(R) CompactCom HMSインダストリアルネットワークス
  5. 5 Okayama IoT Consortium Everyone's IoT ヘルヴェチア

Built-in Modules Product List

16～20 item / All 20 items

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Embedded MXM Module [MXM-Axe]

Embedded MXM Module [MXM-Axe]

Intel Arc GPU equipped MXM 3.1 Type A

ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.

  • Embedded Board Computers

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ZU7/ZU5/ZU4 3U VPX plugin module

ZU7/ZU5/ZU4 3U VPX plugin module

It offers 8GB eMMC flash expandable up to 128GB and various interfaces!

The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)

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SOM-SMARC-Genio700

SOM-SMARC-Genio700

MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.

The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module
  • Embedded Board Computers
  • Other embedded systems (software and hardware)

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[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro

[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro

Everything you need to know about the FA machine platform! - From Intel CPUs to module products, hypervisors, and AI tools -

Rihyo Electro Co., Ltd. will hold a webinar titled "Everything You Need to Know About Platforms for FA Equipment! - From Intel CPUs to Module Products, Hypervisors, and AI Tools" on Wednesday, July 15, 2020. In this seminar, we will introduce the latest products from Congatec, which are optimal for FA equipment, as well as the latest information on Realtime Hypervisor, Windows 10 IoT Enterprise, Azure IoT Edge certification, and Intel embedded products and AI tools like OpenVINO, incorporating case studies related to FA and manufacturing industries. We invite you to register for this seminar. 【Event Overview】 ■ Date and Time: July 15, 2020 (Wednesday) 16:00 - 17:30 (Entry available 10 minutes before start) ■ Participation Fee: Free <Pre-registration required> ■ Venue: Webinar tool "Cocripo" (https://www.cocripo.co.jp/) ■ Registration Method: Registration can only be done through our company website. *For more details, please refer to the PDF document or feel free to contact us.

  • Software (middle, driver, security, etc.)

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BOXER AI Series BOXER-8652AI

BOXER AI Series BOXER-8652AI

Smart inference with Jetson Orin NX - AI anywhere with a compact design of 152mm.

The BOXER-8652AI is a compact, fanless embedded AI system deployed as part of AAEON's AI@Edge solutions. It is equipped with the NVIDIA Jetson Orin NX module, providing powerful AI inference capabilities in a small form factor.

  • BOXER-8641AI_3DBack_01.jpg
  • Industrial PCs
  • Other PCs and OA equipment
  • Desktop PC

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