Plating with few pinholes and high adhesion.
The gaps between metal particles are small, making it difficult for pinholes to form! A plating with strong adhesion.
"Plating with few pinholes and high adhesion" is a technology of Todenka Co., Ltd., which specializes in hoop plating and plating processing. Our various platings, represented by Ni plating, generate very fine metal particles that precipitate onto the metal of the product material. As a result, the meticulously plated surface has few gaps between the metal particles, making it difficult to form pinholes. This condition allows the plating to penetrate into the minute irregularities of the material surface, resulting in a very strong adhesion. Similarly, Sn plating achieves excellent solder wetting properties. *For more details, please refer to the catalog or feel free to contact us.*
- Company:東電化
- Price:Other