Press processing of circuit substrates for copper-clad ceramic substrates
Reduce the cleaning process with oil-free presses and improve quality! Excellent production efficiency in press processing.
"Press processing of copper-clad ceramic substrate circuit materials" uses silicon nitride to punch out the circuit side of copper-clad ceramic substrates using an oil-free press. By using an oil-free press, we eliminated the subsequent cleaning process, dramatically improving quality. The oil-free press also maintains production efficiency, capable of producing over 2 million units per month. [Features] - Small lot production available - Quality improvement (defect rate below 0.8% based on copper-clad substrate appearance standards) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
- Company:山元
- Price:Other