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Sample polishing machine - メーカー・企業9社の製品一覧とランキング

更新日: 集計期間:Sep 03, 2025~Sep 30, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

Sample polishing machineのメーカー・企業ランキング

更新日: 集計期間:Sep 03, 2025~Sep 30, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. ストルアス Tokyo//Testing, Analysis and Measurement
  3. null/null
  4. 4 ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
  5. 5 ウィンゴー Osaka//others

Sample polishing machineの製品ランキング

更新日: 集計期間:Sep 03, 2025~Sep 30, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Manual Sample Grinder "IM-P2" [Made in Japan] アイエムティー
  2. Sample Grinder "KIRIME 250" [Made in Japan] アイエムティー
  3. Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan] アイエムティー
  4. 4 Sample Grinding Machine Individual Load Type 'Rana-5' [Made in Japan] アイエムティー
  5. 5 Sample grinding machine "FORCIPOL series" capable of manual and automatic grinding. ハルツォク・ジャパン

Sample polishing machineの製品一覧

16~30 件を表示 / 全 62 件

表示件数

Sample Grinder (with Grinding Value Setting Function) 'Q-roy' [Made in Japan]

A sample polishing machine that allows setting grinding values for each of the three samples! Automatic polishing is also possible in time mode.

The "Q-roy" is a sample polishing machine that allows for the setting of grinding values in the Z-axis (height) direction for each of the three samples. It can set grinding values in units of 1μm and will automatically stop when the grinding value is reached. Automatic polishing is also possible in time mode. The operation is easy with a large button touch panel and convenient analog buttons. 【Features】 ○ Grinding value setting possible for each of the three samples ○ Polishing possible through time management ○ Automation with auto-drip polishing agent ○ Correction of grinding value errors is possible For more details, please contact us or download the catalog.

  • Other physicochemical equipment

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Sample Grinding Machine Individual Load Type 'Rana-5' [Made in Japan]

High-Spec Dedicated Load Grinding Device

"Rana-5" is an individual load type automatic polishing machine equipped with a standard automatic water supply function. The polishing section and sample rotation section are common specifications with "Rana-3," but the head mechanism is robust with LM guides, making it less prone to lateral shaking during polishing and providing high rigidity. The waterproof model comes with a touch panel and an emergency stop button, and the digital version allows for automatic stop via a timer. It can store 16 polishing conditions and allows for two-step operation settings during polishing. 【Specifications】 ■ Power supply: Single-phase 100V / Single-phase 220V ■ Dimensions/Weight: W450×D640 (to the back)×H520mm (610mm when head is raised) / 94kg ■ Water supply and drainage: Standard automatic water supply function included *For more details, please refer to the PDF document or feel free to contact us.

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  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Sample Grinder "KIRIME 250" [Made in Japan]

Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

The "KIRIME 250" is an automatic polishing machine that can perform two polishing styles with one unit. It features a Φ250mm disc and offers a lineup of various polishing discs including polishing discs (with pressure rings), lapping discs, and magnetic surface discs, which can be exchanged according to the application. The rotation speed is adjustable, with the disc operating at 50–500 rpm and the holder at 50–200 rpm (reversible). 【Disc Lineup】 ■ Polishing disc (with pressure ring) ■ Lapping disc ■ Magnetic surface disc *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Other abrasives

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Two-stage variable grinding conditions are possible! The grinding head can be adjusted left and right by ±50mm!

The "Cyrex-8" is a fully automatic polishing machine that can make two types of changes during a single polishing process. It is possible to set the machine to gradually increase pressure for a few seconds right after the polishing starts (e.g., 15 seconds) and then gradually decrease pressure for a few seconds before finishing (e.g., 10 seconds). We also accept requests for the production of holders with hole shapes tailored to the samples, such as leveling machines and sample holders, so please feel free to consult with us. 【Polishing Unit Specifications】 ■ Holder Size: MAX. φ200mm ■ Disc Size: φ250, 300, 310mm ■ Primary Side Air: Requires an air source of 0.5MPa or more ■ Power Supply: Three-phase 200-220V 50/60Hz ■ Dimensions/Weight: W830×D855×H1730mm / Approximately 450kg *For more details, please refer to the PDF document or feel free to contact us.

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  • Other physicochemical equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.

At IMT Corporation, we accept custom holder production. Based on our extensive data from past polishing achievements, we not only create but also deliver precise and reliable polishing. If you are a customer who wants to polish large samples, or if you want to polish many small samples, or if you have reasons that prevent embedding, please consult with us. 【Examples of polishers we can produce】 ■ Semiconductor wafer polishing machine ■ Surface polishing equipment for LCD panels ■ Shaft polishing equipment ■ Robot polishing machine *For more details, please refer to the related links or feel free to contact us.

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  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Grinding and Polishing Machine "Abrapole-30"

Efficiently polishing large samples or a large quantity of samples in a short time.

The "Abrapole-30" is an advanced polishing and grinding device that uses a fixed sample plate. It features a double droplet system that optimizes the dripping of suspensions and lubricants, a grinding rate sensor, and a safety transparent cover. It can uniformly drip over a wide area, making it compatible with a 350mm diameter disc and a 200mm fixed sample plate. 【Features】 ■ Powerful motor with a robust design to support it ■ Compatible with large samples ■ Easy operation *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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Sample Grinder "Abraplan-30"

High reliability, large capacity, precise and efficient surface grinding equipment.

The "Abrasive Plan-30" is an advanced surface grinding machine that can accommodate fixed sample plates with a diameter of up to 200mm. It is suitable for processing large samples or a large number of samples continuously in the field. Additionally, it reduces working time and enhances the productivity of the grinding and polishing processes. 【Features】 ■ High precision and powerful performance ■ Easy and fast operation ■ Large capacity *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Fully Automatic Grinding and Polishing Solution 'Xmatic'

Complete automation of the grinding and polishing process! Reducing human errors and ensuring very high reproducibility.

The "Xmatic" is a fully automated grinding and polishing solution for high-throughput laboratories. It can accommodate up to 8 sample plates at once, allowing various methods to be assigned to each sample plate. Once the consumables are placed in their designated positions, they are recognized by a unique data matrix code, and their positions are automatically registered in the user interface. Additionally, we offer the "Xmatic Compact," which is suitable for situations with limited installation space. 【Features】 ■ Maximizes reproducibility with consistent fully automated grinding and polishing ■ Improves lab efficiency by minimizing the working time of sample preparation operators per sample ■ Increases throughput through optimized high-quality sample preparation processes ■ Enhances safety in the working environment with minimal human resources ■ Simplifies processes with quick, easy, and intuitive operation *For more details, please refer to the PDF document or feel free to contact us.

  • Testing Equipment and Devices
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

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Sample Grinder "OSK 97XJ 1000B"

The speed, pressure, and time settings of the grinding wheels and automatic polishing devices can be adjusted continuously!

The "OSK 97XJ 1000B" is an automatic sample polishing device with one polishing wheel station that has a disk size of 250mm. This product can polish up to six samples with a diameter of Φ30mm simultaneously. With microprocessor control, the speed, pressure, and time settings for the polishing wheel and automatic polishing device can be adjusted continuously. 【Features】 ■ Can polish six samples simultaneously ■ Energy-efficient and cost-effective product *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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High-Precision Quantitative Sample Grinder 'OSK 97UO SP'

Adopts a high torque output 750W servo motor! Maintains stable torque output.

The "OSK 97UO SP" is a device that allows for high-precision, quantitative polishing while measuring the grinding amount during automatic polishing. It can be utilized for grinding and polishing various materials such as optical lenses, semiconductor wafers, and metals. The grinding amount is displayed in real-time on an LCD screen. (Resolution: 1μm, Stability Accuracy: 10μm) 【Features】 ■ The grinding amount of the sample can be set, and the operation will automatically stop when the set value is reached. ■ The sample's rotation, forward and backward swinging, and the swing range can be set. ■ The cooling system can be switched on or off automatically or manually. ■ 7-inch LCD touchscreen control panel, capable of saving and editing 20 sets of data. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録