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Structural Analysis(se) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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Structural Analysis Product List

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Business Information: Process Analysis

Research on key innovative process technologies, optimization of manufacturing costs, and improvement of yield!

The process helps determine the cost, quality, and performance of devices, and often compensates for design flaws. TechInsights employs 10 process experts and provides the collective expertise accumulated over more than 140 years in device structure analysis. Devices include but are not limited to CMOS, bipolar, BiCMOS, GaAs, SiGe, copper, low-k dielectrics, SOI, strained silicon, MEMS, and TFT. Using data collected through TechInsights' specialized technology, we provide information on the structure, material composition, critical dimensions, and manufacturing processes of your products or competing products in the form of process analysis reports. 【Example Issues Addressed】 - How to embed memory (flash, DRAM, SRAM, FeRAM) into logic devices - How to mitigate risks when transitioning to more advanced process generations - What transistor performance major competing products have - How RF devices are integrated into CMOS For more details, please contact us or download the catalog.

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Panasonic ReRAM 8-bit microcontroller structural analysis

Panasonic ReRAM-equipped MN101LR05D 8-bit microcontroller

The MN101LR05D is a low-power 8-bit single-chip microcontroller developed for portable healthcare, security devices, and sensor processing. The MN101LR05D features a CPU core with a 10MHz 8-bit AM13L, 64KB of ReRAM capacity, and 4KB of SRAM capacity. The MR101LR05D is the world's first mass-produced practical example of ReRAM (Resistive RAM), and it is expected to be widely utilized as a successor technology to existing non-volatile memory. The MN101LR05D is manufactured using a 180nm CMOS process with four layers of AI metallization. The ReRAM cell of this metal oxide is formed between stack W vias connecting metal 3 to metal 4. The results of the report are based on data from scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy-dispersive X-ray analysis (TEM-EDS), electron energy loss spectroscopy (TEM-EEKS), and spreading resistance measurement (SRP).

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