865 Ceramabond Heat-Resistant Ceramic Adhesive Aluminum Nitride
Heat-resistant ceramic adhesive 865 Odec, adhesive for high thermal conductivity ceramics (aluminum nitride, boron nitride), etc.
It is based on aluminum nitride, has high thermal conductivity, and is insulating. It is used for bonding ceramics and metals, as well as ceramics to each other, in sensors and other applications where thermal conductivity is required.
- Company:ツールシステム ツールエクスプレス
- Price:Other