Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'
Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.
"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.
- Company：名東電産
- Price：Other
