![[Column] Behind the Development of CoCo Processing](https://image.mono.ipros.com/public/product/image/1b7/2000746503/IPROS67051158141747232253.png?w=280&h=280)
[Column] Behind the Development of CoCo Processing
This is a story related to the development of the "CoCo process," which involves bringing the metal mask opening closer to the pads on the substrate.
This column explains the "development story of CoCo processing." "CoCo processing" can be described in one word as a process that absorbs the height differences of the silk printed characters on the circuit board and brings the metal mask openings closer to the pads on the circuit board. By absorbing the height differences of the silk during squeegeeing and bringing the openings closer to the circuit board pads, it is possible to suppress smudging caused by gaps between the circuit board and the metal mask, as well as excessive solder due to the height of the silk, thereby improving the stability of the printing process. [Contents] ■ What is "CoCo processing" in the first place? ■ Background of CoCo processing development ■ How the specifications for CoCo processing were determined ■ The subsequent development of CoCo processing ■ Origin of the name "CoCo processing" *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.
- Company：メイコーテクノ
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