Precision Polishing Machine Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

ムサシノ電子 Tokyo//Industrial Machinery
アイエムティー Wakayama//Testing, Analysis and Measurement
シーケービー Tokyo//Trading company/Wholesale
4 パルメソ Niigata//Testing, Analysis and Measurement
5 null/null

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Precision Polishing Machine Product ranking

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

OTEC / Precision Polishing Device "Drag Finish Machine" シーケービー
Precision Grinding Device "MA-200e" ムサシノ電子
"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET' パルメソ
4 [Column] Episode 2 Part 1 - Solve the Drainage Problem - アイエムティー
4 [Column] Episode 1 Part 1 - Everything Started with Meeting IMT - アイエムティー

Precision Polishing Machine Product List

16～21 item / All 21 items

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Precision Grinding Device Attachment Exchange Type 'KIDF-2065-100'

It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.

The 『KIDF-2065-100』 is a state-of-the-art attachment exchangeable polishing device that applies tape polishing technology and accommodates a wide variety of workpiece shapes. Equipped with a rotating mechanism for the polishing head, it can perform polishing not only on the outer surface of cylindrical objects but also on corner R surfaces and tapered sections. Additionally, internal diameter polishing has become possible through the exchange of attachments. 【Features】 ■ The polishing head can be pressed against the workpiece at an angle suitable for the polishing surface. ■ By exchanging the attachments, internal diameter polishing is possible for diameters ranging from φ20 to 65mm and depths up to 100mm. ■ The polishing head can be swung up to 90°, allowing for polishing up to the edge. ■ Environmentally friendly polishing processes are possible. ■ Selection of polishing films suitable for the material of the workpiece can be made. ★ Test processing is always welcome! Please feel free to contact us if you are interested. * For more details, please refer to the PDF materials. Inquiries are also welcome.

Company：Kovax Corporation
Price：Other

Wafer processing/polishing equipment

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[Polishing Example] Precision polishing to prevent cracks and fissures in the inner diameter of holes.

There is a possibility of cracks occurring from burrs and fine scratches on the inner diameter of holes machined into the workpiece, and this is an example of prevention through precision grinding. *Example gift!

Are there any cracks that occur from burrs or fine scratches on the inner diameter of holes cut into the workpiece? This is an introduction to a case study on precision grinding that prevents cracks from such cut holes. When holes are drilled through cutting, there is a possibility of cracks occurring from burrs or fine scratches. By precision grinding the inner diameter of the hole, scratches can be eliminated, preventing cracks. *For more details, please contact us directly. *Please view the PDF of the case studies available for download.

Company：石田研磨工業所
Price：Other

Processing Contract
Hand polishing and filing
Wafer processing/polishing equipment

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Musashino Electronics Co., Ltd. General Catalog

High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.

This catalog features products handled by Musashino Electronics Co., Ltd., such as "ultra-precision grinding machines" and "experimental precision scribers." Our grinding machines possess high flatness accuracy on the rotating reference plate due to their structural characteristics, guaranteeing flatness of 5μm or less. In addition to a diverse range of grinding machines, we also introduce various "automatic grinding (sample holding) units" and "flatness correction tools" that respond to the diversifying applications. [Featured Products] ■ Ultra-precision grinding machines ■ Automatic grinding (sample holding) units ■ Flatness correction tools and various auxiliary devices ■ Various sample holders ■ Grinding discs *For more details, please refer to the PDF document or feel free to contact us.

Company：ムサシノ電子
Price：Other

Wafer processing/polishing equipment

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Precision Grinding Device "MA-200"

There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

Company：ムサシノ電子
Price：Other

Wafer processing/polishing equipment
Other processing machines

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Precision Grinding Device "MA-150"

Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

Company：ムサシノ電子
Price：Other

Wafer processing/polishing equipment
CMP Equipment
Other processing machines

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Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

Company：ムサシノ電子
Price：Other

Wafer processing/polishing equipment

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