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Precision Sheet Metal Processing Products Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 13, 2025～Sep 09, 2025
This ranking is based on the number of page views on our site.

Precision Sheet Metal Processing Products Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 13, 2025～Sep 09, 2025
This ranking is based on the number of page views on our site.

  1. 早野研工 Gifu//Ferrous/Non-ferrous metals 本社(大垣工場）
  2. タニテクニカル Aichi//Manufacturing and processing contract
  3. 東開製作所 Tokyo//Manufacturing and processing contract
  4. 4 広川熔工 Hiroshima//Manufacturing and processing contract
  5. 4 null/null
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Precision Sheet Metal Processing Products Product ranking

Last Updated： Aggregation Period:Aug 13, 2025～Sep 09, 2025
This ranking is based on the number of page views on our site.

  1. Illustrate the exterior exposed surfaces to reduce costs (as indicated in the drawings). 早野研工 本社(大垣工場）
  2. Tani Technical Co., Ltd. Company Profile タニテクニカル
  3. Precision sheet metal processing products 東開製作所
  4. Introduction of the Handy Fiber Laser Welding Machine FLW1500MT 広川熔工
  5. 4 Leave precision sheet metal and long-length processing to us! We won't keep you waiting for new sample production.

Precision Sheet Metal Processing Products Product List

31～45 item / All 56 items

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device chassis

This is a precision sheet metal processing product made from 1.2mm SPCC (cold-rolled steel sheet). In semiconductor-related work, particularly high processing accuracy and tolerance dimensions are required in sheet metal processing. The main process starts with punching, followed by pre-processing, bending, painting, and final inspection. This product is used as the chassis part of semiconductor equipment. The production time is estimated to be a few days to just under a week, including painting, for a lot size of 50 to 100.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device components

This is a precision sheet metal processing product made from aluminum material (A5052P) with a thickness of 1.5mm. The main process starts with punching, followed by pre-processing and bending. After forming is completed, anodizing treatment is performed, followed by stud installation, silk screening, and final inspection. This product is used as a back plate for semiconductor equipment and requires high processing precision and tolerance dimensions. The production time, including anodizing treatment and silk screening, is estimated to be 2 to 3 days.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Commercial operation box

This is a precision sheet metal processing product made from SPCC with a thickness of 1.2mm and 0.8mm. The main process starts with punching, followed by pre-processing, bending, and welding. After forming is completed, the product undergoes painting, silk screening, and final inspection in that order. As this product is a precision sheet metal product, it requires high processing accuracy and tolerance dimensions. The production time, including painting and silk screening, is approximately 4 days.

  • Touch Panel

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device case

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, bending, and welding. Four types of parts are bent individually using a bender and then joined by welding. After shaping is completed, painting is carried out, followed by final inspection. As this product is a precision sheet metal product, it requires high processing accuracy and tolerance dimensions. The production time, including painting, is approximately 2 to 4 days.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device

This is a semiconductor device made from A5052P (aluminum material) with a thickness of 1.0mm and 1.5mm. The product in the photo is assembled from nine individually manufactured aluminum parts. The parts undergo processes of cutting, pre-processing, and bending, followed by anodizing treatment.

  • Other semiconductor manufacturing equipment

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device case

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is complete, trivalent chromate plating is performed, followed by final inspection. This product is used as a case for semiconductor equipment. The production time, including painting, is approximately 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device stage

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is completed, trivalent chromate plating is performed, followed by final inspection. This product is used as a bracket for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device wiring board

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a wiring board for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductor manufacturing equipment

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device panel

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, and bending in that order. After forming, trivalent chromate plating and silk printing are performed, followed by final inspection. This product is used as a panel for semiconductor equipment. The production time, including plating treatment and silk printing, is approximately 3 to 4 days for a batch of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device base

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, chromate plating is performed, studs are attached, and final inspection takes place. This product is used as a base for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device partition plate

This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.6mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, trivalent chromate plating is performed, studs are inserted, and final inspection takes place. This product is used as a partition plate for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device base

This is a precision sheet metal processing product made from SUS430 (hairline material) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, stud welding, bending, and silk screening in that order. This product is used as a base for semiconductor equipment. The production time, including silk screening, is approximately 2 to 3 days for a lot of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device middle plate

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes are punching, pre-processing, bending, and anodizing in that order. This product is used as a middle plate in semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductors

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Precision sheet metal processing products

Precision sheet metal processing products

Wind pressure device wire mesh

This is a precision sheet metal processing product made from SGC with a thickness of 0.8mm. This product is used as a wire mesh for a wind pressure device. The production time is approximately 1 to 2 days based on a standard lot of 100.

  • Wind Speed/Volume Meter

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Precision sheet metal processing products

Precision sheet metal processing products

Semiconductor device side panel

This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.5mm. The main processes include punching, pre-processing, bending, anodizing, and stud welding in that order. This product is used as a side panel for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a batch of 100 units.

  • Other semiconductor manufacturing equipment

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